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Nano-Enabled Conducting Materials Accelerating Device Applicability

Nano-Enabled Conducting Materials Accelerating Device Applicability

Objective

The project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities
The consortium will integrate materials development with end application requirements in terms of technical performance (thermal/electrical conductivity, processing conditions, materials integrity and adhesion) and unit cost of production to facilitate market adoption. The project will utilise and build on existing CPI pilot facilities (R2R print line) to demonstrate technology integration, manufacturability and produce components for end user evaluation to enable the direct comparison of production techniques.
The project delivers a supply chain to support future commercialisation: incorporating materials suppliers of inks and adhesives, supporting RTO in Formulation and nano-particle production, established high fidelity print equipment manufacturers, electronic device manufacturers, established pilot line facilities and potential end users from the apparel, packaging and healthcare sector – relating to the internet of things.

Coordinator

CENTRE FOR PROCESS INNOVATION LIMITED LBG

Address

Wilton Centre Wilton
Ts10 4rf Redcar Cleveland

United Kingdom

Activity type

Research Organisations

EU Contribution

€ 2 148 875

Participants (12)

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HENKEL ELECTRONIC MATERIALS BELGIUMNV

Belgium

EU Contribution

€ 341 687,50

PRAGMATIC PRINTING LIMITED

United Kingdom

EU Contribution

€ 558 687,50

TEKNOLOGISK INSTITUT

Denmark

EU Contribution

€ 753 375

CONTITECH ELASTOMER-BESCHICHTUNGEN GMBH

Germany

EU Contribution

€ 437 500

NANOGAP SUB-NM-POWDER SA

Spain

EU Contribution

€ 224 700

THOMAS SWAN & CO LIMITED

United Kingdom

EU Contribution

€ 518 000

BSH ELECTRODOMESTICOS ESPANA SA

Spain

EU Contribution

€ 76 947,50

HENKEL KGaA

Germany

EU Contribution

€ 308 000

CROWN PACKAGING MANUFACTURING UK LIMITED

United Kingdom

EU Contribution

€ 171 937,50

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 648 777,50

TYOTERVEYSLAITOS

Finland

EU Contribution

€ 280 051,25

NXP SEMICONDUCTORS BELGIUM NV

Belgium

EU Contribution

€ 351 750

Project information

Grant agreement ID: 720897

Status

Ongoing project

  • Start date

    1 January 2017

  • End date

    31 December 2019

Funded under:

H2020-EU.2.1.2.

  • Overall budget:

    € 8 101 378,75

  • EU contribution

    € 6 820 288,75

Coordinated by:

CENTRE FOR PROCESS INNOVATION LIMITED LBG

United Kingdom