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Pilot line for micro-transfer-printing of functional components on wafer level

Pilot line for micro-transfer-printing of functional components on wafer level

Objective

The “Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level” project (MICROPRINCE) is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (µTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transfer printed to demonstrate the capabilities of the technology and pilot line. Based on several EU and national research activities demonstrating successfully the feasibility of µTP technology in a scientific and laboratory environment, the MICROPRINCE consortium has the goal to setup the first worldwide open access foundry pilot line for heterogeneous integration by µTP and to demonstrate its capability on five defined target application scenarios. For this purpose, the consortium consisting of 13 partners from four different countries combine their expertise along the value chain from materials and equipment, technology and semiconductor processing, integrated circuit and system design, test and application. The partners are industrial companies incl. SME’s, accompanied by leading research institutes with a clear focus on production and application in Europe. The working principle of the micro-transfer-printing technology is to use a micro-structured elastomer stamp to transfer microscale functional components from their native substrates onto non-native substrates. The lateral dimensions of the functional components can range from a few microns to a few hundreds of microns with thicknesses of only a few microns. The native substrate contains the functional components to be printed and is flexible in size and material. The MICROPRINCE pilot line is acting as a regional and nationwide competence cluster for a novel technology with European dimensions for heterogeneous system integration and supports the ECS industry to reach leadership in key applications.

Coordinator

X-FAB MEMS FOUNDRY GmbH

Address

Haarbergstr. 67
99097 Erfurt

Germany

Activity type

Other

EU Contribution

€ 746 112,83

Participants (12)

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X-FAB SEMICONDUCTOR FOUNDRIES GMBH

Germany

EU Contribution

€ 295 559,24

MELEXIS TECHNOLOGIES

Belgium

EU Contribution

€ 140 350

MELEXIS TECHNOLOGIES SA

Switzerland

MELEXIS

Belgium

EU Contribution

€ 83 100

MELEXIS GMBH

Germany

EU Contribution

€ 477 750

X-CELEPRINT LIMITED

Ireland

EU Contribution

€ 67 175,94

HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM

Belgium

EU Contribution

€ 176 344,99

OPTICS BALZERS JENA GMBH

Germany

EU Contribution

€ 97 599,69

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 262 407,62

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 504 867,56

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland

EU Contribution

€ 173 125,40

TECHNISCHE UNIVERSITAET DRESDEN

Germany

EU Contribution

€ 263 946,81

Project information

Grant agreement ID: 737465

Status

Ongoing project

  • Start date

    1 April 2017

  • End date

    31 March 2020

Funded under:

H2020-EU.2.1.1.7.

  • Overall budget:

    € 14 223 356,27

  • EU contribution

    € 3 288 340,08

Coordinated by:

X-FAB MEMS FOUNDRY GmbH

Germany