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A Complimentary Inspection Technique based on Computer Tomography and Plenoptic Camera for MEMS Components

A Complimentary Inspection Technique based on Computer Tomography and Plenoptic Camera for MEMS Components

Objective

For the latest generation of micro-fabricated devices that are currently being developed, no suitable in-line production inspection equipment is available, simply because current inspection equipment expects planar processing while most of the devices are often highly 3D in nature e.g. medical. This lack of automated processing feedback makes it difficult to steer process development towards higher yields in micro-components and MEMS production. Another visible problem is the need to document and record process data, even on the individual device level, with the degree of traceability as is required for example, for medical devices fabricated under ISO13485. Both factors in the end limit the possibility of reliable and cost effective manufacturing of MEMS and micro-components.
Thus, CITCOM has been proposed to address the industrial needs of MEMS and micro-manufacturing which will offer an in-line production inspection and measurement system for micro-components. The system will be developed and demonstrated at TRL7. The system will be based on optical and X-ray techniques combined with computer tomography and advance robotic system capable of analyzing defects that occur in production of micro components e.g. stains, debris, fracture, abnormal displacements, chemical composition of surface coatings, surface traces etc. enabling 98% yield and 100% reliability.
Ultimately, CITCOM will cut such costs by 60% as it will offer a system with automated knowledge and inspection data based process feedback that will allow the detection and traceability of faults that may occur in MEMS production, especially for critical applications like aerospace, space and healthcare.
CITCOM will give Europe a technological and competitive advantage in the growing manufacturing and production industry. The consortium behind this action is strongly driven by industrial need and problem having Philips and Microsemi as end users and validators of the technology.
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Coordinator

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

Address

Rue Jaquet Droz 1
2000 Neuchatel

Switzerland

Activity type

Research Organisations

EU Contribution

€ 813 621,50

Participants (11)

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PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands

EU Contribution

€ 325 452,97

MICROSEMI SEMICONDUCTOR LIMITED

United Kingdom

EU Contribution

€ 112 118,13

RAYTRIX GMBH

Germany

EU Contribution

€ 308 249,38

Teknologian tutkimuskeskus VTT Oy

Finland

EU Contribution

€ 345 561,25

TWI LIMITED

United Kingdom

EU Contribution

€ 770 105

EXCILLUM AB

Sweden

EU Contribution

€ 460 551

aixACCT Systems GmbH

Germany

EU Contribution

€ 450 094,53

POLYTEC LIMITED

United Kingdom

EU Contribution

€ 102 554,38

ACONDICIONAMIENTO TARRASENSE ASSOCIACION

Spain

EU Contribution

€ 238 562,50

INNOVATIVE TECHNOLOGY AND SCIENCE LIMITED - INNOTECUK

United Kingdom

EU Contribution

€ 306 293,75

BRUNEL UNIVERSITY LONDON

United Kingdom

EU Contribution

€ 529 871,25

Project information

Grant agreement ID: 768883

Status

Ongoing project

  • Start date

    1 October 2017

  • End date

    30 September 2020

Funded under:

H2020-EU.2.1.5.1.

  • Overall budget:

    € 5 648 170,25

  • EU contribution

    € 4 763 035,64

Coordinated by:

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

Switzerland