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Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers

Wafer-scale, CMOS integration of photonics, plasmonics and electronics devices for mass manufacturing 200Gb/s non-return-to-zero (NRZ) transceivers towards low-cost Terabit connectivity in Data Centers

Objective

The goal of the PlaCMOS project is to develop and demonstrate the next generation optical-electronic CMOS platform that will enable transceivers capable of real-time communication with data rates exceeding 200 Gb/s. To achieve this goal the PlaCMOS platform will be based on the latest bipolar CMOS (BiCMOS) technology and will be cointegrated with a ferroelectric plasmonic and SiGe detector technology. By exploiting plasmonics rather than photonics PlaCMOS will not only be able to extend the bandwidth far beyond 100 GHz but also reduce the footprint of the photonics device to the micrometer scale. To demonstrate the technology, a single channel 200 Gb/s non-return-to-zero (NRZ) transmitter and receiver pair will be implemented. To further show the scalability an ultra-compact 4 x 50 Gb/s transceiver directly interfacing a multicore optical fiber will be implemented and tested for temperature stability beyond 150 degree Celsius. And while the project goes far beyond the current state-of-the art, the approach is not speculative but is substantiated by recent experiments performed by the members of the consortium that indicate that both electronic and photonic limits can be stretched beyond the current limits. To this end a team with complementary skill sets from both industry and universities – all with outstanding track records in the field – have committed to address the needs outlined in current roadmaps for data communication. This project will demonstrate the capabilities of the technology for a single exemplary field of applications. Yet, the project has far wider implications with applications that go beyond the field of communications.
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Coordinator

MELLANOX TECHNOLOGIES LTD - MLNX

Address

Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam

Israel

Activity type

Private for-profit entities (excluding Higher or Secondary Education Establishments)

EU Contribution

€ 481 250

Participants (6)

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MICRAM MICROELECTRONIC GMBH

Germany

EU Contribution

€ 751 721,25

EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH

Switzerland

EU Contribution

€ 582 000

IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

Germany

EU Contribution

€ 723 560

ARISTOTELIO PANEPISTIMIO THESSALONIKIS

Greece

EU Contribution

€ 512 000

IBM RESEARCH GMBH

Switzerland

EU Contribution

€ 611 471,25

UNIVERSITAT DES SAARLANDES

Germany

EU Contribution

€ 374 375

Project information

Grant agreement ID: 780997

Status

Ongoing project

  • Start date

    1 December 2017

  • End date

    30 November 2020

Funded under:

H2020-EU.2.1.1.

  • Overall budget:

    € 4 036 377,50

  • EU contribution

    € 4 036 377,50

Coordinated by:

MELLANOX TECHNOLOGIES LTD - MLNX

Israel