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Microwave Microscopy for Advanced and Efficient Materials Analysis and Production

Microwave Microscopy for Advanced and Efficient Materials Analysis and Production

Objective

Products which require complicated material systems and nanoscale structural organization, e.g. third-generation solar cells, are often difficult to develop. This is because electronic properties of bulk semiconductors are often masked or at least strongly superimposed by material interface properties. Additionally these interface properties are also complex and thus make product design difficult.

This project aims at solving this problem by offering a nanoscale characterization platform for the European manufacturers of coatings, photovoltaic cells, and semi-conductor circuits. It is proposed to use a combination of scanning microwave microscopes, dielectric resonators, and simulation to measure the material and interface properties of complicated material systems and nano-structures. A metrological system of cross-checks between different instruments, models and simulations with associated error bars is indispensable for obtaining trustworthy results.

Scanning microwave measurements will be directly used for three-dimensional characterization of electrical properties of nanostructured semiconductors used in organic and hybrid photovoltaic cells. The objective is to accelerate the development of high efficiency cells and to have measures to predict performances in early stages of prototype production. Where process monitoring of materials with nanostructures is necessary, a dielectric resonator is used to translate insights from scanning microwave microscope measurements to fabrication environments. Such dielectric resonators could be directly integrated in production lines for monitoring thin film deposition processes.

An open innovation environment will make the uptake of the results easier for European industry. A database containing exemplary measurement datasets of scanning microwave microscopes will be available in calibrated and raw versions. Simulation results of tip-semiconductor interactions will be made available on the EMMC Modeling Market Place.
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Coordinator

UNIVERSITE DE LILLE

Address

42 Rue Paul Duez
59800 Lille

France

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 544 322,50

UNIVERSITE DES SCIENCES ET TECHNOLOGIES DE LILLE - LILLE I

Address

Cite Scientifique Batiment A3
59655 Villeneuve D'Ascq

France

Activity type

Higher or Secondary Education Establishments

Participants (8)

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EIDGENOSSISCHES INSTITUT FUR METROLOGIE METAS

Switzerland

EU Contribution

€ 783 468,75

QWED SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA

Poland

EU Contribution

€ 387 750

MATERIA NOVA

Belgium

EU Contribution

€ 425 616,25

EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH

Switzerland

EU Contribution

€ 291 700

KEYSIGHT TECHNOLOGIES GMBH

Austria

EU Contribution

€ 676 250

DRACULA TECHNOLOGIES

France

EU Contribution

€ 339 693,75

ADAMANT AERODIASTIMIKES EFARMOGES ETAIREIA PERIORISMENIS EFTHYNIS

Greece

EU Contribution

€ 344 000

AYMING

France

EU Contribution

€ 199 375

Project information

Grant agreement ID: 761036

Status

Ongoing project

  • Start date

    1 November 2017

  • End date

    31 October 2020

Funded under:

H2020-EU.2.1.3.

  • Overall budget:

    € 3 992 176,25

  • EU contribution

    € 3 992 176,25

Coordinated by:

UNIVERSITE DE LILLE

France