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Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond

Objective

Efforts to develop optical interfaces with Terabit capacity for datacom applications have kicked off. A practical path to the Terabit regime is to scale the current 400G modules, which are based (in the most forward looking version of the standards) on 4 parallel lanes, each operating with PAM-4 at 53 Gbaud. Scaling these modules by adding lanes looks simple, but entails challenges with respect to the fabrication and assembly complexity that can critically affect their manufacturability and cost. TERIPHIC aims to address these challenges by leveraging photonic integration concepts and developing a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines of Terabit modules. TERIPHIC will bring together EML arrays in the O-band, PD arrays and a polymer chip that will act as the host platform for the integration of the arrays and the wavelength mux-demux of the lanes. The integration will rely on butt-end-coupling steps, which will be automated via the development of module specific alignment and attachment processes on commercial equipment. The optical subassembly will be mounted on the mainboard of the module together with linear driver and TIA arrays. The assembly process will be based on the standard methodologies of MLNX and the use of polymer FlexLines for the interconnection of the optical subassembly with the drivers and the TIAs. Using these methods, TERIPHIC will develop pluggable modules with 8 lanes (800G capacity) and mid-board modules with 16 lanes (1.6T capacity) having a reach of at least 2 km. Compared to the 400G standards, the modules will reduce by 50% the power consumption per Gb/s, and will have a cost of 0.3 Euro/Gb/s. After assembly, the modules will be mounted on the line cards of MLNX switches, and will be tested in real settings. A study for the consolidation of the methods and the set up of a pilot assembly line in the post-project era will be also made.

Call for proposal

H2020-ICT-2018-20

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Sub call

H2020-ICT-2018-2

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Coordinator

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS
Net EU contribution
€ 756 250,00
Address
Patission Str. 42
10682 Athina
Greece

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Region
Κεντρικός Τομέας Αθηνών Aττική Αττική
Activity type
Research Organisations
Non-EU contribution
€ 0,00

Participants (5)

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany
Net EU contribution
€ 1 906 480,00
Address
Hansastrasse 27c
80686 Munchen

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Region
Bayern Oberbayern München, Kreisfreie Stadt
Activity type
Research Organisations
Non-EU contribution
€ 0,00
FICONTEC SERVICE GMBH
Germany
Net EU contribution
€ 451 325,00
Address
Rehland 8
28832 Achim

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Niedersachsen Lüneburg Verden
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 193 425,00
III-V LAB
France
Net EU contribution
€ 556 815,00
Address
1 Avenue Augustin Fresnel Campus Polytechnique
91767 Palaiseau Cedex

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Region
Ile-de-France Ile-de-France Essonne
Activity type
Other
Non-EU contribution
€ 238 635,00
MELLANOX TECHNOLOGIES LTD - MLNX
Israel
Net EU contribution
€ 875 411,25
Address
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam

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Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 375 176,25
TELECOM ITALIA SPA
Italy
Net EU contribution
€ 191 187,50
Address
Via Gaetano Negri 1
20123 Milano

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Region
Nord-Ovest Lombardia Milano
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 81 937,50