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Micro assembled Terabit/s capable optical transceivers for Datacom applications

Objective

Data centers which underpin the Cloud are under pressure. As the capacity of data center servers is growing, so must the capacity of the links between those servers. Industry foresees a need for high volumes of 800Gb/s and 1.6Tb/s transceivers by 2025.
Today, despite the use of complex Photonic Integrated Circuits (PICs), manufacturing an optical transceiver still requires a large number of sequential steps. This is because lasers and electronic chips need to be assembled on a piece-by-piece basis onto the PIC. The resulting optical engine then needs to be coupled to a fiber array and packaged. These steps are done sequentially, creating a bottleneck in the manufacturing line which makes it hard to scale up production and reduce cost.
CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro transfer printing technique, thus eliminating this bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud capable driver and receiver electronics will be transfer printed onto Silicon Photonic 300mm wafers. Starting from proven concepts in PIXAPP, a novel fast fiber attachment process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude. Using these techniques, transceiver cost will be 0.1Euro/Gb/s for volumes of at least 1,000,000 units.
The consortium, which consists of three SMEs (X-Celeprint, Innolume and ficonTEC), an LE (EVGroup), three research institutes (IMEC, Tyndall and IHP), a transceiver manufacturer (Mellanox) and a multinational (Xilinx) encompasses all the partners to start production of the targeted optical transceivers after the end of the project. Exploitation of the technology will be supported by an end-user (British Telecom), a semiconductor foundry setting up a micro transfer printing Pilot Line (MICROPRINCE, X-FAB), an optical equipment manufacturer (ADVA) and the European Photonic Industry Consortium (EPIC).

Call for proposal

H2020-ICT-2018-20

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Sub call

H2020-ICT-2018-2

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Net EU contribution
€ 2 547 368,75
Address
Kapeldreef 75
3001 Leuven
Belgium

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Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Research Organisations
Non-EU contribution
€ 0,00

Participants (9)

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Ireland
Net EU contribution
€ 471 506,25
Address
Western Road
T12 YN60 Cork

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Region
Ireland Eastern and Midland Dublin
Activity type
Higher or Secondary Education Establishments
Non-EU contribution
€ 0,00
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Germany
Net EU contribution
€ 1 012 500,00
Address
Im Technologiepark 25
15236 Frankfurt Oder

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Region
Brandenburg Brandenburg Oder-Spree
Activity type
Other
Non-EU contribution
€ 0,00
X DISPLAY COMPANY TECHNOLOGY LIMITED

Participation ended

Ireland
Net EU contribution
€ 17 768,62
Address
6Th Floor, 2 Grand Canal Square
2 Dublin

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Region
Ireland Northern and Western Border
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 7 615,13
INNOLUME GMBH
Germany
Net EU contribution
€ 355 162,50
Address
Konrad-adenauer-allee 11
44263 Dortmund

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Nordrhein-Westfalen Arnsberg Dortmund, Kreisfreie Stadt
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 152 212,50
MELLANOX TECHNOLOGIES LTD - MLNX
Israel
Net EU contribution
€ 322 953,75
Address
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam

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Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 138 408,75
XILINX IRELAND UNLIMITED COMPANY
Ireland
Net EU contribution
€ 71 312,50
Address
Logic Drive Citywest Business Campu
D24T683 Dublin

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Region
Ireland Eastern and Midland Dublin
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 30 562,50
FICONTEC SERVICE GMBH
Germany
Net EU contribution
€ 323 925,00
Address
Rehland 8
28832 Achim

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Niedersachsen Lüneburg Verden
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 138 825,00
EV GROUP E. THALLNER GMBH
Austria
Net EU contribution
€ 256 375,00
Address
Di Erich Thallner Strasse 1
4782 St Florian Am Inn

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Region
Westösterreich Oberösterreich Innviertel
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 109 875,00
X-CELEPRINT LIMITED
Ireland
Net EU contribution
€ 467 856,38
Address
6Th Floor 2 Grand Canal Square
D02 A342 Dublin

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Region
Ireland Eastern and Midland Dublin
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Non-EU contribution
€ 200 509,87