Advanced packaging for mass produced optical, photonics and electrical parts
Europe’s semiconductor packaging industry needs to maintain its competitive advantage. To achieve this goal, a decisive turn to advanced and more complex processes is necessary. The EU-funded APPLAUSE project will develop new processes, methods and tools for packaging mass produced optical and electrical parts. The project will conduct pilot tests in six manufacturing use cases. Backed by a consortium of leading experts from European electronics packaging companies and research organisations, the overall aim of the project is to offer advanced technologies and contribute to the competitiveness of the European packaging industry.
Fields of science
Call for proposal
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Funding SchemeECSEL-IA - ECSEL Innovation Action
6423806 Tel Aviv - Jaffa