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Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Objective

The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (GE Healthcare and Cardiaccs) 6. Optical water measurement modules with cost-effective packaging of components (Vaisala) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.

Coordinator

ICOS VISION SYSTEMS NV

Address

Esperantolaan 8c
3001 Heverlee

Belgium

Activity type

Other

EU Contribution

€ 511 750

Participants (31)

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ROODMICROTEC GMBH

Germany

EU Contribution

€ 377 394,38

NUROMEDIA GMBH

Germany

EU Contribution

€ 178 375

Pac Tech - Packaging Technologies GmbH

Germany

EU Contribution

€ 128 250

DISCO HI-TEC EUROPE GMBH

Germany

EU Contribution

€ 105 350

OSYPKA AG

Germany

EU Contribution

€ 187 375

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 1 264 468,84

WURTH ELEKTRONIK GMBH & CO KG

Germany

EU Contribution

€ 193 000

Besi Netherlands BV

Netherlands

EU Contribution

€ 151 659,25

ADVANCED PACKAGING CENTER BV

Netherlands

EU Contribution

€ 141 062,50

STICHTING IMEC NEDERLAND

Netherlands

EU Contribution

€ 256 578,44

JSR MICRO NV

Belgium

EU Contribution

€ 106 863,75

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 347 053,88

VAISALA OYJ

Finland

EU Contribution

€ 108 464,75

GE HEALTHCARE FINLAND OY

Finland

EU Contribution

€ 107 425

AFORE OY

Finland

EU Contribution

€ 163 437,50

OY EVERON AB

Finland

EU Contribution

€ 78 077,74

PRECORDIOR OY

Finland

EU Contribution

€ 111 032,50

TURUN YLIOPISTO

Finland

EU Contribution

€ 299 105,63

AALTO KORKEAKOULUSAATIO SR

Finland

EU Contribution

€ 160 030,50

INTEGRATED DETECTOR ELECTRONICS AS

Norway

EU Contribution

€ 260 325

Cardiaccs

Norway

EU Contribution

€ 14 312,50

UNIVERSITETET I SOROST-NORGE

Norway

EU Contribution

€ 307 431,25

AMS AG

Austria

EU Contribution

€ 698 450

BESI AUSTRIA GMBH

Austria

EU Contribution

€ 502 078,55

EV GROUP E. THALLNER GMBH

Austria

EU Contribution

€ 276 918

ALBIS OPTOELECTRONICS AG

Switzerland

EU Contribution

€ 164 062,50

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

Switzerland

EU Contribution

€ 160 772,50

ALMAE TECHNOLOGIES

France

EU Contribution

€ 448 500

SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG

Hungary

EU Contribution

€ 297 600

DUSTPHOTONICS LTD

Israel

EU Contribution

€ 341 343,75

ELEKTRONIKAS UN DATORZINATNU INSTITUTS

Latvia

EU Contribution

€ 113 050

Project information

Grant agreement ID: 826588

Status

Ongoing project

  • Start date

    1 May 2019

  • End date

    30 April 2022

Funded under:

H2020-EU.2.1.1.7.

  • Overall budget:

    € 34 558 714,32

  • EU contribution

    € 8 561 598,71

Coordinated by:

ICOS VISION SYSTEMS NV

Belgium