The accelerated electrification in different sectors raises higher requirements on the reliability of electronics, which stimulates the demand for novel electronic interconnection materials. This proposed training-through-research aims to design new electronic interconnection materials to tackle three emerging bottlenecks in electronics manufacturing, which are i) low process-temperature solders to reduce energy consumption and facilitate 3D integration in consumer electronics, ii) high-reliability solders for harsh environments in the automotive and aerospace sectors, and iii) novel die-attach materials to enable the use of wide-bandgap power semiconductors. Advanced experiments and simulation techniques will be used to design novel solder alloys, study solidification microstructures, and evaluate the reliability and understand the deformation/failure mechanisms of solder joints. Comprehensive understandings on composition-processing-microstructure-property relationships will be built-up to drive the development of the three novel electronic interconnection materials in this project: i) novel multi-compositional low-temperature solders with refined microstructure and excellent ductility and strength superior to conventional Sn-Bi solders, ii) advanced high-reliability solders strengthened by mechanisms from microstructures of different scales including not only solid solutions and secondary phases but also grain structures and orientations that have not been incorporated by current solders, and iii) novel transient liquid phase bonding (TLPB) materials that can significantly reduce the processing time and produce refined high entropy intermetallic bonds with mechanical properties overmatching current TLPBs. This inter-/multi-disciplinary project promises a tremendous positive impact on the European consumer electronics, power electronics, and automotive and aerospace sectors, contributing to the European excellence, competitiveness, and quality of manufacturing.
Fields of science
Call for proposal
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