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Content archived on 2022-12-23

New Methods for Thermal Investigation of Integrated Circuits

Objective

This project aims to develop new methods for thermal investigation of integrated circuits, based on temperature monitoring using novel sensor elements. Work will include:
"in-vivo" temperature monitoring, which can be applied to the highly reliable ICs
laboratory investigation of the novel structures by infrared thermography, by liquid crystals and by simulation
measuring and qualification of the thermal properties of new IC packages, including development of a new concept thermal measuring instrument.

Topic(s)

Data not available

Call for proposal

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Coordinator

University Joseph Fourier
EU contribution
No data
Address
Avenue Félix Viallet 46
38031 Grenoble Cedex
France

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Total cost
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Participants (4)