Silicon substrates multi chip modules for innovative products

Projektinformationen

SUMMIT

ID Finanzhilfevereinbarung: FP4_20492

Startdatum 1 Dezember 1995

Enddatum 31 Mai 1999

Finanziert unter

• Specific research and technological development programme in the field of information technologies, 1994-1998

Gesamtkosten € 5 338 000,00

EU-Beitrag € 2 500 000,00

Koordiniert durch

Dicryl Sa
Spain

Ziel

- Industrial production procedures for the manufacture of marketable products are to be developed from the basic technology. Special substrates and MCMs will be produced to evaluate the parameters of this technology.

- Cell libraries for both active and passive components to be used in the design of substrates will be made available.

- Various built in test structures are to be designed and integrated on to silicon substrates. In this way the testability of MCMs can be improved by the use of active substrates.

- A set of analogue and digital simulation cells is to be designed and made available for simulation of the substrate system before production.

- Operative MCMs demonstrating the tools and technologies developed are to be produced. These will undergo a full characterisation to ensure that they comply with the requirements of specific applications in terms of reliability and quality.

A cost-efficient, commercial manufacturing base is to be established in silicon-based multi-chip modules (MCMs) with active substrates and ball grid array interconnects. The new feature of this technology is the integration of passive and active components in the substrate which would otherwise be connected to an MCM via wirebonding. The first level connection of the standard ICs to the substrate is done using a flip chip interconnect. Development of a commercial source for wafer rerouting to facilitate flip chip interconnects also constitutes a major project goal.

Wissenschaftliches Gebiet

• natural sciences › chemical sciences › inorganic chemistry › metalloids

Programm/Programme

• FP4-ESPRIT 4 - Specific research and technological development programme in the field of information technologies, 1994-1998

Thema/Themen

• 2.10 - Semiconductors-Enhancement of technology & manufacturing base

Aufforderung zur Vorschlagseinreichung

Data not available

Finanzierungsplan

EST - Marie Curie actions-Early-stage Training

Koordinator

Dicryl Sa

• EU-Beitrag: Keine Daten
• Adresse: Parque Tecnologico De Boecillo ; Boecillo ; Spanien
• Gesamtkosten: Keine Daten

Beteiligte (5)

Centro Nacional de Microelectronica

Spanien

• EU-Beitrag: Keine Daten
• Adresse: Campus Uab ; 08193 Bellaterra
• Gesamtkosten: Keine Daten

Dassault Electronique

Frankreich

• EU-Beitrag: Keine Daten
• Adresse: Quai Marcel Dassault 55 ; 92214 Saint-Cloud
• Gesamtkosten: Keine Daten

Eidgenoessische Technische Hochschule Zuerich

Schweiz

• EU-Beitrag: Keine Daten
• Adresse: Gloriastr. 35 ; 8092 Zuerich
• Gesamtkosten: Keine Daten

National Microelectronics Research Centre, University College Cork

Irland

• EU-Beitrag: Keine Daten
• Adresse: Lee Maltings, Prospect Row ; Cork
• Gesamtkosten: Keine Daten

Sibet Gmbh

Deutschland

• EU-Beitrag: Keine Daten
• Adresse: Garbsener Landstrasse 10 ; 30419 Hannover
• Gesamtkosten: Keine Daten