Laser soldering is likely to be the only way to reach the high quality and reliability demanded of super high-density modern hybrid electronic components. But the use of laser radiation as a source of heating in soldering processes, for example in electron component mountings, is limited by a range of factors, including the fact that it does not correspond to the production demand volume in this field.

This project will therefore study the metallurgical processes that take place in the heating zone during the action of laser radiation with wavelengths of 1.06 mkm and a duration of 1-2ms for each soldering element: solders and pins of electronic components. These processes are applied to parts with high mounting density (more than 2-3 solderings per mm{2}) and with typical dimensions of about 0.1mm. During this project the basic ways of heating electronic component mountings will be investigated and the heat and mass transmission will be analysed.

The results of this research will enable a more valid physical model of the process to be designed and more precise demands for materials and equipment for high-density mounting devices to be formulated.