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Development of innovative manufacturing techniques for the production of super large silicon wafers for the next millennium

Objective

US and Japanese companies currently lead the field in semiconductor manufacture. It is of strategic importance to provide European companies with new technologies which they can then deploy to head off non-European competition. The aim of this project is to develop a cost reducing, reliable and quality oriented process chain for 200 and 300 mm water manufacturing It provides an substantial contribution to the modernisation of European semiconductor equipment industry. The development of up to now unknown machines and processes like the multi-wire slicing with new wire guidance features, the unprecedented high throughput double- side grinding of the sliced wafers and the development of a new wafer geometry metrology device leads to a sustained improvement of European competitiveness against its us and Japanese competitors.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

THEMIS A.S.
Address
Horni Paseky 1389
756 61 Roznov Pod Radhostem
Czechia

Participants (7)

EINDHOVEN UNIVERSITY OF TECHNOLOGY
Netherlands
Address
Horsten 2
5600 MB Eindhoven
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
Address
Steinbachstrasse 17
52074 Aachen
INGENIEURSBUREAU SPAAN IBS
Netherlands
Address
Bedrijfsweg, 1
5683 CM Best
INSTITUTE FOR PRODUCT DEVELOPMENT
Denmark
Address
Building 358 Dtu
2800 Lyngby
OKMETIC OY
Finland
Address
2,Pütie 2
01510 Vantaa
SUPFINA GRIESHABER GMBH & CO. KG
Germany
Address
Haupstrasse 1-5
77709 Oberwolfach
TYROLIT SCHLEIFMITTELWERKE SWAROVSKI KG
Austria
Address
33,Swarovskistrasse 33
6130 Schwaz