US and Japanese companies currently lead the field in semiconductor manufacture. It is of strategic importance to provide European companies with new technologies which they can then deploy to head off non-European competition. The aim of this project is to develop a cost reducing, reliable and quality oriented process chain for 200 and 300 mm water manufacturing It provides an substantial contribution to the modernisation of European semiconductor equipment industry. The development of up to now unknown machines and processes like the multi-wire slicing with new wire guidance features, the unprecedented high throughput double- side grinding of the sliced wafers and the development of a new wafer geometry metrology device leads to a sustained improvement of European competitiveness against its us and Japanese competitors.
Funding SchemeCSC - Cost-sharing contracts
5600 MB Eindhoven
5683 CM Best