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Large area plasma etching process for display applications

Objective

European Flat Panel Display manufacturers have to introduce lower cost processes by using very large substrates (1m2) in order to be competitive and to gain market share. The main technological barrier for scaling up production reactors is Reactive Ion Etching (RIE) for which there is no technological solution on the market. The present project proposes the development of RIE process enabling 1 m2 substrate processing for two of the most promising display technologies:1. Active Matrix crystal Displays for computer screens.2. Organic Light emission displays for automotive applications. The project is based on a new principle of plasma source patented by one of the partners, which allows the production of a high density plasma over 1m2 with excellent homogeneity. The project proposes to develop RIE process for the 2 applications mentioned on small scale reactors, transfer it to an industrial prototype (1m2) and validate the process for beta
High plasma generation over the whole source area (1011 ions.cm-3);
- Promising results of preliminary etching tests (uniformity better than 10% over 70 x 70 cm2);
- Gas mixture optimized to increase etching selectivity (Si02/Si) and ITO/Glass;
- The procedure of substrate characterisation for OLED applications.

Call for proposal

Data not available

Coordinator

CENTRO RICERCHE FIAT S.C.P.A.
EU contribution
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Address
Strada torino 50
10043 Orbassano
Italy

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Total cost
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Participants (5)