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Meshes and Global Integration for Semiconductor Front-End Simulation

Cel

The lack of appropriate tools for adaptive meshing of arbitrary, and partly time-dependent, non-planar geometries is the main bottleneck for the industrial use of three-dimensional process and device simulation. In MAGIC_FEAT this limitation will be removed. The required meshing tool will be developed in cooperation between a leading semiconductor company, a software house, semiconductor research institutions with special expertise in the fields of process simulation and meshing, and a leading meshing group. The activities include a topologically correct and accurate surface discretisation, the generation and adaptation of bulk meshes for fixed and time-dependent geometries, the integration of the newly developed meshing tools into an existing three-dimensional process simulator, and an evaluation at industrial benchmarks using advanced physical models.

Zaproszenie do składania wniosków

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System finansowania

CSC - Cost-sharing contracts

Koordynator

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Wkład UE
Brak danych
Adres
HANSASTRASSE 27C
80686 MUENCHEN
Niemcy

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Koszt całkowity
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Uczestnicy (5)