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High-resolution optical non-destructive evaluation for electro-optical leading-edge microsystems

Obiettivo

The ever higher pace of miniaturisation of microelectronic systems asks for high-resolution non-destructive measurement techniques for in-process quality control, and optimisation of simulation tools to shorten design-to-product time. The proposal aims at the development of a laser optical sub-micrometer resolution deformation measurement tool for in-situ investigations of microsystems such as BGA, flip-chip, fibre- and micro-optic components as well as of lead-free solder bonds and material interfaces. For selected systems, thermo-mechanical FEM-models are developed and simulations are optimised and applied together with the measurement system to obtain realistic material and thermo-mechanical parameters. The findings will be disseminated through application reports and are a prerequisite for design and process optimisation and reliability analysis.

Invito a presentare proposte

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Meccanismo di finanziamento

CSC - Cost-sharing contracts

Coordinatore

DANTEC ETTEMEYER GMBH
Contributo UE
Nessun dato
Indirizzo
Kaesbohrerstrasse 18
89077 ULM
Germania

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Costo totale
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Partecipanti (4)