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Next Generation Active Integrated Optic Subsystems

Objective

We propose to develop existing integrated optical microresonator technology into a robust, densely-integrated active photonic platform, to create an optical subsystem on a chip. The subsystem will combine functions such as high-speed optical switching, modulation, and wavelength multiplexing and filtering, in a scalable manner, to eventually handle hundreds of optical information channels. These functions are becoming increasingly vital to realize fiber optic access networks that provide high-bandwidth telecommunications services to the home or desktop. By using optical microresonator technology and organic electro-optic materials large-scale photonic integration of active functions is feasible. A new generation integrated optic technology will be developed that eventually leads to low-power, highly manufacturable and hence low-cost network subsystem on a chip, which can be deployed in increasingly local optical network nodes. We propose to develop existing integrated optical microresonator technology into a robust, densely-integrated active photonic platform, to create an optical subsystem on a chip. The subsystem will combine functions such as high-speed optical switching, modulation, and wavelength multiplexing and filtering, in a scalable manner, to eventually handle hundreds of optical information channels. These functions are becoming increasingly vital to realize fiber optic access networks that provide high-bandwidth telecommunications services to the home or desktop. By using optical microresonator technology and organic electro-optic materials large-scale photonic integration of active functions is feasible. A new generation integrated optic technology will be developed that eventually leads to low-power, highly manufacturable and hence low-cost network subsystem on a chip, which can be deployed in increasingly local optical network nodes.

OBJECTIVES
--investigate the properties of new passive as well as organic electro-optic optical materials for use in compact waveguide devices--develop software tools for design of active microresonator structures and of complex integrated optic subsystems with a large number of functional elements and apply these tools in innovative designs --using hybrid integration of passive and active materials, realise a working prototype of microresonator-based mux/demux and high-speed switch and modulator and a complete subsystem on a chip with these functions--characterise devices and modules and verify specifications--investigate/demonstrate the feasibility of a commercially viable technology platform for high bandwidth optical access networking

DESCRIPTION OF WORK
We propose to develop existing integrated optical microresonator technology into a robust, densely-integrated active photonic platform, to create an optical subsystem on a chip. The subsystem will combine functions such as high-speed optical switching, modulation, and wavelength multiplexing and filtering, in a scalable manner, to eventually handle hundreds of optical information channels. These functions are becoming increasingly vital to realize fiber optic access networks that provide high-bandwidth telecommunications services to the home or desktop. By using optical microresonator technology and organic electro-optic materials large-scale photonic integration of active functions is feasible. A new generation integrated optic technology will be developed that eventually leads to low-power, highly manufacturable and hence low-cost network subsystems on a chip, which can be deployed in increasingly local optical network nodes.For the realisation of the final deliverable, a subsystems with active functions, a chain of activities will be carried out that include the study of the materials aspects of special passive and organic electro-optic optical materials, development and application of new design tools, the technological realisation and the detailed characterisation of devices. Parallel to this activities system studies are performed in order to supply specifications and assure the relevance of the new devices and subsystems. Special attention is given to the manufacturability and a possible route to large scale, low-cost production of the proposed subsystems.

MILESTONES


Funding Scheme

CSC - Cost-sharing contracts

Coordinator

UNIVERSITEIT TWENTE
Address
Drienerlolaan 5
7522 NB Enschede
Netherlands

Participants (13)

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
France
Address
3, Rue Michel-ange
75794 Paris Cedex 16
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
France
Address
3, Rue Michel-ange
75794 Paris Cedex 16
CONCEPT TO VOLUME B.V.
Netherlands
Address
Colosseum 20
7521 PT Enschede
ECOLE NATIONALE SUPERIEURE DE CHIMIE DE MONTPELLIER
France
Address
8 Rue Ecole Normale
34296 Montpellier
ECOLE NORMALE SUPERIEURE DE CACHAN
France
Address
Avenue Du President Wilson 61
94235 Cachan
FRANCE TELECOM
France
Address
6 Place D'alleray
75505 Paris 15
NONLINEAR OPTICS LABORATORY INSTITUTE OF QUANTUM ELECTRONICS, ETH
Switzerland
Address
Hoenggerberg - Hpf E7
8093 Zuerich
NORTEL NETWORKS UK LIMITED
United Kingdom
Address
Maidenhead Office Park, Westacott Way
SL6 3QH Maidenhead Berkshire
PRODUITS CHIMIQUES AUXILIAIRES ET DE SYNTHESE
France
Address
23, Rue Bossuet
91160 Longjumeau
RAINBOW PHOTONICS AG
Switzerland
Address
Einsteinstrasse Eth Hoenggerberg Hpf E7
8093 Zuerich
TUHH TECHNOLOGIE GMBH
Germany
Address
Harburger Schlossstrasse 6-12
21079 Hamburg
UNIVERSITA DEGLI STUDI DI ROMA "LA SAPIENZA"
Italy
Address
Piazzale Aldo Moro 5
00185 Roma
USTAV RADIOTECHNIKY A ELEKTRONIKY AV CR
Czechia
Address
Chaberska 57
182 51 Praha 8