CORDIS
EU research results

CORDIS

English EN

NETwork of excellence in microelectronic system integration technologies-PACKaging

Objective

A Network of Excellence in Microlectronic Packaging (NETPACK III) will be installed which continues the previous activities of NETPACK I and NETPACK II. During the last project more than 450 companies and institutes became a member of NETPACK. The activities in the network will be done within five workpackages. In the WP Packaging Store, Vision Lab and Education Pool information on advanced packaging technology and student education will be collected from the network members and provided by an internet based information system. The WP NETPACK Club will install a communication platform for the network members. The WP Management will coordinate the network activities and establish contacts to other networks and packaging organizations worldwide.

Objectives:
- to install an internet based Packaging Store, which provides advanced information on materials, equipment and services for the microelectronic packaging
- to provide information on future trends in products and technologies
- to strengthen significantly the education of European packaging engineers
- to encourage discussion between network members by am internet communication platform
- to improve constantly the network performance by feedback from the members.

Work description:
A Network of Excellence in Microlectronic Packaging (NETPACK III) will be installed which continues the previous activities of NETPACK I and NETPACK II. During the last project more than 450 companies and institutes became a member of NETPACK. The activities in the network will be done within five workpackages. In the WP Packaging Store, Vision Lab and Education Pool information on advanced packaging technology and student education will be collected from the network members and provided by an internet based information system. The WP NETPACK Club will install a communication platform for the network members. The WP Management will coordinate the network activities and establish contacts to other networks and packaging organizations worldwide.

Milestones:
- Re-activation of the network and feedback from NETPACK members
- Installation of the Packaging Store information system
- Benchmarking and improvement of the network performance.
Expected results:
- Significant support of research, development and production of microlectronic packages.

Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

TECHNISCHE UNIVERSITAET BERLIN

Address

Strasse Des 17. Juni 135
10623 Berlin

Germany

Participants (3)

Sort alphabetically

Expand all

ACREO AB

Sweden

BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM

Hungary

EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH

Switzerland

Project information

Grant agreement ID: IST-2001-33013

  • Start date

    1 December 2001

  • End date

    30 November 2003

Funded under:

FP5-IST

  • Overall budget:

    € 681 862

  • EU contribution

    € 500 000

Coordinated by:

TECHNISCHE UNIVERSITAET BERLIN

Germany