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Network Interconnected Photoacoustic Gas Sensing Microsystems

Objective

A photoacoustic (PA) gas sensing microsystem will be developed, including thermal IR emitter, sealed PA microchamber and IR detector. Main features of such modules will be high sensitivity, high selectivity, high stability, moderate cost and network compatibility with aerospace or other (car, domestic) networks.

The project aims at developing the required micromachined silicon components, at assembling these into gas sensing microsystems and at testing their performance in a number of challenging applications:
(i) aircraft early fire detection,
(ii) air pollution monitoring and
(iii) refrigerant leak detection.
In the course of this cooperative effort the consortium partners aim at establishing user/supplier relationships necessary to bring this leading edge technology towards market adoption.

Objectives:
Main objective: Realisation of network compatible and failsafe photoacoustic gas sensing microsystems. Target gases will be CO, CO2 and refrigerants. Main target performances: Measurement range 0-1000 ppm or 0-2000 ppm, resolution below 1 ppm, short term accuracy better than 10 ppm and long-term stability better than 30 ppm per year.

Subset objectives:
a) Realising a silicon micromachined photoacoustic chamber with a piezoresistive microphone and a thermopile reference infrared sensor, filled with the target gas at wafer level using anodic bonding,
b) Realising a silicon micromachined emitter with high speed and high emissivity,
c) Realising a gas sensing module with all the key components,
d) Development of the software for logic control, digital signal conditioning and interfacing,
e) Test and evaluation in end user applications.

Work description:
- Realisation of a silicon micromachined photoacoustic chamber with an integrated piezoresitive microphone and a thermopile reference infrared sensor, filled with the target gas at wafer level during anodic bonding.
- Realisation of a gas sensing microsystem with all the key components, like the photoacoustic chamber, the infrared emitter with high speed and high infrared radiation efficiency and signal conditioning electronics.
- Development of the software/firmware for the microcontroller used for logic control, digital signal conditioning and interfacing using a microcontroller with integrated analog-to-digital converters and on-chip read-only and random access memory, giving a large cost reduction advantage.
- Development of a network interface for the interconnection of the PA system with on-board bus systems for aerospace, automotive and domestic applications.
- Realisation of prototype modules allowing for the selective detection of CO2 (CO) and refrigerants, respectively. The main difference between these will be that photoacoustic chambers are filled with CO2 (CO) or refrigerants, respectively, and that one or two filters in the infrared path are tailored to optimise selectivity and sensitivity.
- Testing and evaluation in end user applications to verify performance and versatility of the photoacoustic technique.

Milestones:
Prototypes of micromachined key components (IR emitters, IR thermopile detectors, silicon microphones).
Prototypes of integrated PA gas sensing microsystems containing lifetime fillings with target gas performed during anodic wafer bonding.
PA system evaluation in several end-user applications and networks (aerospace, environmental, commercial).

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Coordinator

EADS DEUTSCHLAND GMBH

Address

Willy-Messerschmitt-Strasse
85521 Ottobrunn

Germany

Participants (5)

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AUXITROL SA

France

CONSIGLIO NAZIONALE DELLE RICERCHE

Italy

FARSIDE TECHNOLOGY PLC

United Kingdom

SENSONOR ASA

Norway

SINTEF - STIFTELSEN FOR INDUSTRIELL OG TEKNISK FORSKNING VED NORGES TEKNISKE HOEGSKOLE

Norway

Project information

Grant agreement ID: IST-2001-37802

  • Start date

    1 September 2002

  • End date

    31 March 2006

Funded under:

FP5-IST

  • Overall budget:

    € 2 985 014

  • EU contribution

    € 1 492 506

Coordinated by:

EADS DEUTSCHLAND GMBH

Germany