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DIAMOND FOR APPLICATIONS IN THERMAL MANAGEMENT

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CVD diamond has been demonstrated to have great potential to improve the conduction cooling of high power electronic devices. Reduced temperatures increase both the reliability and the performance of these devices. Processes have been demonstrated for the fabrication of diamond tiles up to 50mm in diameter and over 0.5mm thick. The deposition processes developed have been microwave plasma assisted CVD, hot filament CVD and chemical vapour infiltration. To fabricate heat spreader components, laser cutting, lapping and polishing, and bonding techniques have been developed. Lapping and polishing can achieve surface finishes as good as 10nm Ra. Laser cutting can be achieved with cut edge taper angles down to 6 . Characterisation has shown that thermal conductivities up to 1960 W/m/K can be achieved.

Demonstrator devices for automobile applications using CVD diamond plates as thermal conductor and electrical insulator material have been developed. The prototype devices have shown that in the design using CVD diamond, the overall thermal resistivity is lowered and thus, reduced temperature increases can be achieved in comparison with the conventional design. Three dimensional packaging demonstrator devices have been fabricated using test chips which generate a controlled amount of heat. These blocks have shown that diamond heat spreaders can realise reduced device temperatures using diamond fins protruding from the block. Semiconductor laser demonstrator devices have also been fabricated, mounting indium phosphide laser diode arrays on diamond tiles. All the demonstrator devices have shown that the thermal boundary resistances can have a significant influence on the overall performance of the device, indicating the importance of low thermal resistance bonding technology.
The deposition of diamond by various chemical vapour deposition (CVD) technologies is now well established. The unique thermal electrical and mechanical properties of diamond make it an outstanding engineering material in many applications requiring careful thermal management. It is believed that this area is likely to be the first major application area for CVD diamond outside cutting and grinding tools.

This programme will assess a number of innovative CVD techniques including chemical vapour infiltration of preforms and assess their potential for producing free standing diamond layers (0.5mm thick) with a thermal conductivity at least three times that of copper at a cost of less than 50 ECU/cm{2}.

Existing techniques will be developed to process free standing diamond layers of 25x25mm for use in a number of demanding electronic applications. A number of demonstrators will be produced which will include an automotive device for use within an engine management system and the 3D integration of a microprocessor and associated memory chips into a block no more than 25 mm{3} designed to dissipate over 25 Watts of power.

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Data not available

Finanzierungsplan

CSC - Cost-sharing contracts

Koordinator

GEC Marconi Materials Technology Ltd
EU-Beitrag
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Adresse
Caswell
NN12 8EQ Towcester
Vereinigtes Königreich

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Letzte Aktualisierung: 26 Februar 1993

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Permalink: https://cordis.europa.eu/project/id/BRE20154/de

European Union, 2024