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High Density Integration of Dies into Electronics Substrates

Ziel

The HIDING DIES project aims to develop a highly innovative technology for embedding active chips into high-density printed circuit boards. This 3-dimensional integration will enable a high degree of miniaturization, improved electrical and thermal performance for mobile and communication products. The technological steps are bonding of thin chips (50 µm) on multilayer substrates, embedding of the chips by vacuum lamination of a dielectric layer (RCC), followed by laser drilling of via holes to the chip contacts and to the substrate and finally metallization of vias and conductor lines. For a further increase of functional density integrated passive components can be combined with the chip embedding. The resulting sub-systems with integrated components additionally allow assembly of surface mount devices on the bottom and top surface. All required process steps will be based on existing technologies, however their combination to a cost-effective high-yielding technology require significant scientific and technological research. Besides the process development, a detailed understanding of thermo-mechanical, thermal and electrical performance of such integrated systems has to be achieved. Furthermore development effort has to be made to explore technological limits by handling and bonding very large and very thin chips (50 µm) and by stacking multiple layers with integrated components.

The achievement of the development goals will be assessed using two demonstrators, specified by end users. A sensor device combines a surface mounted MEMS chip with embedded control circuits, resulting in an extremely small footprint.

The other demonstrator is a power RF application. Target is to create a miniaturized module with excellent electrical and heat conducting properties. With the IC's embedded in the substrate, short connections to filter structures and assembled discrete SMD's at the surface, a compact miniature module can be created.

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Finanzierungsplan

STREP - Specific Targeted Research Project

Koordinator

TECHNISCHE UNIVERSITAET BERLIN
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Adresse
Gustav-Meyer-Allee 25
13355 BERLIN
Deutschland

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Letzte Aktualisierung: 20 Dezember 2005

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Permalink: https://cordis.europa.eu/project/id/507759/de

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