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The application of polymer electronics towards ambient intelligence

The application of polymer electronics towards ambient intelligence

Objective

Things that think and the communication of people with such things in his environment critically depend on contactless communication technologies. RF communication devices and protocols have been developed in the past and exist today, yet in their present form they cannot and will never be used on a large scale to allow communication with everyday objects.

The fundamental reason for this is the cost of the silicon technology employed to realize it. Even in its most optimistic projection, this cost remains at least one order of magnitude higher than the cost of a technology that has been proven to be truly ubiquitously applicable, such as a barcode. Therefore, a new generation of devices is required to enable ambient intelligence at the right cost point in order to be truly applicable everywhere and anywhere.

The objective of PolyApply is to lay the foundations of a scalable and ubiquitously applicable communication technology. The boundary condition is the cost of the microsystem, combining basic RF communication with sensor functions. The key to achieving a fundamentally different cost point than what will be reachable in the future with the evolution of the existing technologies (e.g. CMOS), is to resolutely move to adisruptive new manufacturing technology: going from batch processing to in-line manufacturing technology.

The semiconductor system envisaged to this end is based on polymers. The scalable aspect refers to the fact that PolyApply does not plan to propose a solution for a certain generation of RF communication devices useful at one point in time, but rather intends to develop generic technologies with a meaningful impact in the mid- and long term. In other words, the developed technologies will lead to an extendable family of products, ranging from "simple" RF tags at ultra-low cost to RF communication devices with complex functionality such as integrated re-writable memory, sensory inputs, display, etc…

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Coordinator

STMICROELECTRONICS S.R.L.

Address

Via Olivetti 2
20041 Agrate Brianza

Italy

Administrative Contact

Participants (17)

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CESKE VYSOKE UCENI TECHNICKE V PRAZE

Czechia

COMMISSARIAT A L'ENERGIE ATOMIQUE

France

EM MICROELECTRONIC-MARIN S.A.

Switzerland

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

HUECK FOLIEN GMBH

Austria

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

Belgium

JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH

Austria

MERCK CHEMICALS LTD

United Kingdom

MOTOROLA GMBH

Germany

PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands

PLASTIC LOGIC LIMITED

United Kingdom

POLYIC GMBH & CO.KG

Germany

TECHNISCHE UNIVERSITAET BRAUNSCHWEIG

Germany

TECHNISCHE UNIVERSITAET CHEMNITZ

Germany

UNIVERSITY OF LIVERPOOL

United Kingdom

VDI/VDE INNOVATION + TECHNIK GMBH

Germany

ZEILER AG

Switzerland

Project information

Grant agreement ID: 507143

  • Start date

    1 January 2004

  • End date

    31 March 2008

Funded under:

FP6-IST

  • Overall budget:

    € 23 134 087

  • EU contribution

    € 12 000 000

Coordinated by:

STMICROELECTRONICS S.R.L.

Italy