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European Network for Co-ordination of Advanced Semiconductor Technologies

Ziel

The objective of ENCAST is to organize a Network under the umbrella of a Co-ordinated Action to gather and disseminate information on semiconductor and microelectronic manufacture, assembly, pacakging and test technologies to the European electronics manufacturing industry. Typical technologies to be monitored include wafer scale packaging, 3D packaging, SiP, SOP, MCM, stacked packages, Pb-free soldering etc. This will be carried out by organizing workshops and meetings on the above technologies and disseminating the information via a regularly published newsletter and on a web site freely accessible to the semiconductor and microelectronics engineering community. Information will also be gathered and disseminated by the same method by attending other workshops, conferences, meetings, etc. worldwide. In particular standards for the procurement and use of semiconductor die will be persued by participation in the IEC TC 47 working group producing the IEC 62258 standard, by organizing an International workshop CAST 2005, by co-ordinating with other groups such as Netpack, NEXUS-Plus, SEMI Europe, DPC and the Napa KGD workshop in the USA. Also a Die Products User Club will be formed to assist SME's in the use of these components and technologies in Europe.

Schlüsselbegriffe

Aufforderung zur Vorschlagseinreichung

Data not available

Finanzierungsplan

CA - Coordination action

Koordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
EU-Beitrag
Keine Daten
Adresse
Kapeldreef
3001 LEUVEN
Belgien

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Gesamtkosten
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Beteiligte (7)