CORDIS
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CORDIS

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Flexible circuits processing, performance and reliability using lead-free soldering process

Project information

Grant agreement ID: 513163

  • Start date

    1 February 2005

  • End date

    30 April 2007

Funded under:

FP6-SME

  • Overall budget:

    € 1 837 580

  • EU contribution

    € 1 045 878

Coordinated by:

TWI LIMITED

United Kingdom

Objective

Flexible circuit boards are a functionally pivotal and rapidly growing technology for electronics goods. Applicationsinclude: computer peripherals (e.g. flat panel displays, ink-jet printers, disc drives), hand held devices (e.g. GPS, personaldigital assistants, membrane keyboards), telecommunications (mobile phones), automotive (e.g. engine controls,dashboards/connections), smart cards (antenna foils), aerospace (lightweight, compact systems) and medical devices (e.g.sensors). The drive to use flexible circuits is based on the technologies ability to: reduce size, weight, assembly time andcost, accommodate relative movement between component parts, increase system reliability (reduced interconnect), improvecontrolled impedance signal transmission and heat dissipation and enable three dimensional packaging.These benefits have resulted in a significant increase in the use of flexible circuits for electronics and systems assembly,particularly consumer products. The global market size has been estimated by various bodies to be between 4 billion to 7billion with anticipated growth rates up to 15% per year.Flexible circuits are most commonly manufactured using one of two base materials, either polyimide or polyester. Theformer is favoured where soldering is required, the latter is generally used in low cost applications. Both flexible circuitmaterial systems are sensitive to temperature (continuous service temperature: polyimide ~177C, polyester ~74C), whichraises considerable concerns as to their capabilities of withstanding the higher soldering temperatures, which will beimposed by lead-free solder and its impact on their operating properties. As flexible circuits are developing into such asignificant technology for electronic products, with a major role in manufacturing and assembly being played by SMEs, it isessential that an understanding of the impact of this major change in technology on flexible circuits is #

Coordinator

TWI LIMITED

Address

Granta Park, Great Abington
Cambridge

United Kingdom

Participants (12)

ELDOS SPOLKA Z ORGRANICZONA ODPOWIEDZIALNOSCIA

Poland

FLEXIBLE TECHNOLOGY LIMITED

United Kingdom

FLEX-ABILITY LTD

United Kingdom

KOMED MANUFACTURING AND TRADING COMPANY LTD

Hungary

EPIGEM LIMITED

United Kingdom

INTERNATIONAL CONSULTING BUREAUX

Germany

ICI BELGIUM NV

Belgium

KIC INTERNATIONAL SALES INC

United Kingdom

FREUDENBERG FORSCHUNGSDIENSTE KG

Germany

GTS FLEXIBLE MATERIALS LTD

United Kingdom

BUDAPEST UNIVERSITY OF TECHNOLOGY AND ELECTRONICS

Hungary

UNIVERSITY OF GREENWICH

United Kingdom

Project information

Grant agreement ID: 513163

  • Start date

    1 February 2005

  • End date

    30 April 2007

Funded under:

FP6-SME

  • Overall budget:

    € 1 837 580

  • EU contribution

    € 1 045 878

Coordinated by:

TWI LIMITED

United Kingdom

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