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European Lead-Free Soldering Network

European Lead-Free Soldering Network

Objective

The EU RHS Directive requiring removal of lead hazard from electronics production processes in Europe by 2006 is now in force and is in line with similar initiatives in Japan and the US seeking greater sustainability. The necessary lead-free soldering environmental technology exists and has-been in development for a number of years but now requires urgent research and industry coordination on a pan-European scale in order to support the transformation of European industry and improve competitiveness. Several major EU, Regional and National research projects are underway or proposed and industry implementation has already begun. However the technology is seriously lacking in integration and synergy, particularly with regard to candidate countries, and there is no coherent knowledge base. 'ELFNET - European Lead-Free Soldering Network', is a Coordination Action that will address these problems by using a new organisational model to create a network of 40key partners from across Europe. It is a 3-dimensional structure with recognised Technical Experts from each field, Industry Networks from each sector and National Networks in 19 countries. It will aim to mobilise and optimise the necessary critical mass of research and development in an industry-led initiative and provide vital technology information to each Member State.'

Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

ITRI LIMITED

Address

Unit 3, Curo Park, Frogmore
St Albans, Hertfordshire

United Kingdom

Administrative Contact

Jeremy PEARCE (Dr)

Participants (34)

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DELTA DANSK ELEKTRONIK, LYS & AKUSTIK

Denmark

EIDGENOESSISCHE MATERIALPRUEFUNGS- UND FORSCHUNGSANSTALT

Switzerland

TEKNILLINEN KORKEAKOULU

Finland

INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW

Belgium

FUNDACION INASMET

Spain

INSTITUTE OF MECHANICS OF MATERIALS AND GEOSTRUCTURES S.A.

Greece

INSTITUTE OF PHYSICS OF MATERIALS - ACADEMY OF SCIENCES OF THE CZECH REPUBLIC

Czechia

INSTITUTO DE SOLDADURA E QUALIDADE

Portugal

IVF INDUSTRIFORSKNING OCH UTVECKLING AB

Sweden

ECOLE NATIONALE SUPERIEURE D'ELECTRONIQUE, INFORMATIQUE ET RADIOCOMMUNICATIONS DE BORDEAUX

France

UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland

POLITECNICO DI MILANO

Italy

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK - TNO

Netherlands

UNIVERSITAET WIEN

Austria

TECHNISCHE UNIVERSITAET BERLIN

Germany

SINTEF - STIFTELSEN FOR INDUSTRIELL OG TEKNISK FORSKNING VED NORGES TEKNISKE HOEGSKOLE AS

Norway

INSTYTUT METALURGII I INZYNIERII MATERIALOWEJ - POLSKIEJ AKADEMII NAUK

Poland

FYZIKALNY USTAV - SLOVENSKEJ AKADEMIE VIED

Slovakia

ABELIA

Norway

BAE SYSTEMS (OPERATIONS) LIMITED

United Kingdom

MARKETING ET TECHNOLOGIES AVANCEES S.A.

France

CELESTICA LIMITED

United Kingdom

SOLECTRON GMBH

Germany

FCI S.A.

France

SCHNEIDER ELECTRIC INDUSTRIES SAS

France

W.C. HERAEUS GMBH & CO. KG

Germany

HENKEL LOCTITE ADHESIVES LIMITED

United Kingdom

PANDA EUROPE

United Kingdom

PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands

HEWLETT-PACKARD CENTRE DE COMPETENCES FRANCE SAS

France

ROBERT BOSCH GMBH

Germany

AMI SEMICONDUCTOR BELGIUM BVBA

Belgium

AVANTEC SA

France

Siemens AG

Germany

Project information

Grant agreement ID: 505504

  • Start date

    1 April 2004

  • End date

    31 March 2007

Funded under:

FP6-NMP

  • Overall budget:

    € 2 455 095

  • EU contribution

    € 2 309 872

Coordinated by:

ITRI LIMITED

United Kingdom