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3-D-integrated micro/nano modules for easily adapted applications

3-D-integrated micro/nano modules for easily adapted applications

Objective

As electronic sensor systems are becoming more complex and individualised, standard state of the art approaches will not be anymore appropriate to meet the objectives (cost, reliability, time to market, etc.) of the future. The innovative approach presented here will realize e-CUBES, .i.e. investigate and develop 'small sensor cubes' which are wireless communicating among each other. The e-CUBES will build-up an ad-hoc network to realize the desired system functionality.

e-CUBES addresses various multi-disciplinary applications in the important field of wireless sensor networks, with special emphasis but not limited to the following key application areas:
- Distributed smart monitoring for Aeronautics and Space applications;
- Wireless sensor networks for Health and Fitness;
- Distributed intelligent Automotive Control.
Particular focus of e-CUBES is on the following technologies:
- Individual technologies at various layer levels, suitable for 3D integration;
- Layer processing/thinning technologies for 3D integration;
- 3D assembling and packaging;
- New communication means, e.g. antennas, passive and RF integration, and communication networks;
- Power supply and power management for portable applications;
- Design methodologies for the 3D SoC and related simulation tools.

The e-CUBES technology poses particular challenges with regard to the desirable sizes (a few cubic millimetres), the need to achieve continuous operation through an integrated or external wireless power supply, and the necessity of allowing multiple e-CUBES to communicate. The system is characterized by a large number of individual interconnected e-CUBES. The "e-CUBES" vision therefore represents a new approach to systems integration that will help to develop complex, flexible and cost-efficient.

Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

INFINEON TECHNOLOGIES AG

Address

Am Campeon 1-12
85579 Neubiberg

Germany

Participants (20)

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3D PLUS SA

France

COMMISSARIAT A L'ENERGIE ATOMIQUE

France

ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE

FRAUNHOFER IAF

Germany

HONEYWELL ROMANIA SRL

Romania

INFINEON TECHNOLOGIES AUSTRIA AG

Austria

INFINEON TECHNOLOGIES SENSONOR AS

Norway

INSTYTUT TECHNOLOGII ELEKTRONOWEJ

Poland

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

NXP SEMICONDUCTORS BELGIUM NV

Belgium

PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands

PHILIPS INTERNATIONAL B.V.

Netherlands

PHILIPS TECHNOLOGIE GMBH FORSCHUNGSLABORATORIEN AACHEN

Germany

STIFTELSEN SINTEF

TECHNISCHE UNIVERSITAET BERLIN

Germany

THALES ALENIA SPACE FRANCE

France

THALES SYSTEMES AEROPORTES S.A.

France

UNIVERSITAET PADERBORN

Germany

UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland

UPPSALA UNIVERSITET

Sweden

Project information

Grant agreement ID: 026461

  • Start date

    1 February 2006

  • End date

    31 January 2009

Funded under:

FP6-IST

  • Overall budget:

    € 20 802 407

  • EU contribution

    € 11 999 999

Coordinated by:

INFINEON TECHNOLOGIES AG

Germany