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MAsk less lithoGraphy for IC manufacturing (MAGIC)

MAsk less lithoGraphy for IC manufacturing (MAGIC)

Objective

MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.

In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool prices play also an important role in the overall cost of ownership of this technique. This trend opens opportunity for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developped by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron beam lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments.

This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focused on MAPPER and IMMS-NANO tools developments with the objective to deliver a first ML2 alpha platform compatible with 32 nm half pitch technology before 2010, aligned with the semiconductor manufacturer requirements. In relation with this activity, the program will develop the required infrastructure for the usage of this tools in an industrial environment. Among the tasks to be addressed, there is a delivery of a reliable software platform to treat the data base preparation and to provide solutions for ML2 related electron proximity effects. The last concern of this project will be to demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platform developpeed by the tool partners.

Coordinator

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Address

Rue Leblanc 25
75015 Paris 15

France

Activity type

Research Organisations

EU Contribution

€ 1 735 076

Administrative Contact

Marie-Laure Page (Ms)

Participants (18)

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FACHHOCHSCHULE VORARLBERG GMBH

Austria

EU Contribution

€ 126 544

IMS NANOFABRICATION AG

Austria

EU Contribution

€ 1 069 782

DOW SILICONES BELGIUM

Belgium

FUJIFILM ELECTRONIC MATERIALS (EUROPE) N. V.

Belgium

EU Contribution

€ 24 543

DELONG INSTRUMENTS AS

Czechia

EU Contribution

€ 851 775

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 1 856 498

GLOBALFOUNDRIES Dresden Module One LLC & Co. KG

Germany

EU Contribution

€ 43 113

INSTITUT FUER MIKROELEKTRONIK STUTTGART

Germany

EU Contribution

€ 1 000 176

QIMONDA DRESDEN GMBH & CO.OHG

Germany

EU Contribution

€ 199 543

ASELTA NANOGRAPHICS SA

France

EU Contribution

€ 110 892

STMICROELECTRONICS CROLLES 2 SAS

France

EU Contribution

€ 374 943

SYNOPSYS INTERNATIONAL LIMITED

Ireland

EU Contribution

€ 764 151

KLA-TENCOR CORPORATION (ISRAEL)

Israel

EU Contribution

€ 194 006

MAPPER LITHOGRAPHY B.V.

Netherlands

EU Contribution

€ 3 398 957

Synopsys Armenia CJSC

Armenia

SYNOPSYS SWITZERLAND LLC

Switzerland

SYNOPSYS GMBH

Germany

SYNOPSYS NETHERLANDS BV

Netherlands

Project information

Grant agreement ID: 214945

Status

Closed project

  • Start date

    1 January 2008

  • End date

    31 December 2010

Funded under:

FP7-ICT

  • Overall budget:

    € 16 694 010

  • EU contribution

    € 11 749 999

Coordinated by:

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France