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European platform for low-power applications on Silicon-on-Insulator Technology

Project description


Next-Generation Nanoelectronics Components and Electronics Integration
EUROSOI+ is a CSA project that upgrade the European network on silicon-on-insulator technology set up by the EUROSOI project.

     In the framework of FP6, the European Commission supported the formation of a European Network on Silicon on Insulator Technology, Devices and Circuits, whose main goal was to create a discussion forum for the exchange of ideas and results on the topic of Silicon-On-Insulator technologies in Europe, and to facilitate the synergy between research groups which enables the use of Silicon-On-Insulator (SOI) technology as an effective tool to push the limits of CMOS and prepare for post-CMOS. Today, EUROSOI network comprises more than 30 partners all over Europe, with expertise in all the fields of the SOI technology. EUROSOI network has already made possible a big part of this path by successfully organizing and achieving during the last three years an important number of events such as the EUROSOI roadmap and state of the art documents, workshops, training events, scientific exchanges. .
     EUROSOI+ is a coordination action (CA) project aiming at promotion, maintaining, follow-up and upgrading the activities and the network set up by the previous CA project EUROSOI. Important objectives are: i) Creation of a Permanent European School on SOI Technology; ii) Fostering and co-ordinating the initiatives and activities required to successfully face some of the challenges identified and listed in the updated EUROSOI+ Roadmap for the future. Creation of a consortium to elaborate new research project proposals addressing specific challenges identified in the Roadmap; iii) Development of a research-dedicated platform in order to address circuit design aspects, focussing on the advantage of SOI technology for Low Power applications. This platform will provide, through the integration at some point in EUROPRACTICE, prototyping and Multi-Projects-Wafers in SOI open to European research groups and Fabless Semiconductor companies (SMEs) using LETI SOI process. The long-term goal is to make SOI technology reachable to any European research group or fables Semiconductor Company in order to allow any circuit design to have the chance to become a SOI circuit using European technology.

In the framework of FP6, the European Commission supported the formation of a European Network on Silicon on Insulator Technology, Devices and Circuits, whose main goal was to create a discussion forum for the exchange of ideas and results on the topic of Silicon-On-Insulator technologies in Europe, and to facilitate the synergy between research groups which enables the use of Silicon-On-Insulator (SOI) technology as an effective tool to push the limits of CMOS and prepare for post-CMOS. Today, EUROSOI network comprises more than 30 partners all over Europe, with expertise in all the fields of the SOI technology. EUROSOI network has already made possible a big part of this path by successfully organizing and achieving during the last three years an important number of events such as the EUROSOI roadmap and state of the art documents, workshops, training events, scientific exchanges.The first goal of the present proposal is upgrading and maintaining this important forum, providing upgraded versions of the State-of-the-Art report, Roadmap, facilitating scientific exchanges between partners, organizing workshops and later on, to use it as a launching platform for other important objectives:•Creation of a Permanent European School on SOI Technology.•Fostering and co-ordinating the initiatives and activities required to successfully face some of the challenges identified and listed in the EUROSOI Roadmap for the future. Creation of a consortium to elaborate new research project proposals addressing specific challenges identified in the Roadmap.•Development of a research-dedicated platform in order to address circuit design aspects, focussing on the advantage of SOI technology for Low Power applications. This platform will provide, through the integration at some point in EUROPRACTICE, prototyping and Multi-Projects-Wafers (MPW) in SOI open to European research groups and Fabless Semiconductor companies (SMEs) using LETI SOI process in two-three years.

Fields of science

Programme(s)

Topic(s)

Call for proposal

FP7-ICT-2007-1
See other projects for this call

Funding Scheme

CSA - Coordination and support action

Coordinator

UNIVERSIDAD DE GRANADA
EU contribution
€ 363 301,00
Address
CUESTA DEL HOSPICIO SN
18071 Granada
Spain

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Region
Sur Andalucía Granada
Activity type
Higher or Secondary Education Establishments
Administrative Contact
Francisco Gamiz (Prof.)
Links
Total cost
No data

Participants (8)

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Last update: 19 April 2017

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Permalink: https://cordis.europa.eu/project/id/216373

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