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Knowledge-based multi-scale modelling of metal-oxide-polymer interface behaviour for micro- and nanoelectronics

Knowledge-based multi-scale modelling of metal-oxide-polymer interface behaviour for micro- and nanoelectronics

Objective

Micro- and nano-electronic components are multi-scale in nature, caused by the huge scale differences of the individual materials and components in these products. Consequently, product behaviour is becoming strongly dependent on material behaviour at the atomic scale. To prevent extensive trial-and-error based testing for new technology developments, new powerful quantitative knowledge-based modelling techniques are required. Current continuum-based finite element models rely intrinsically on extensive characterisation efforts to quantify the parameters present in these models (‘top-down’ approach). On the other hand, state-of-the-art models at atomic scale are able to describe the material behaviour at molecular level, but predictions at product scale are not feasible yet. Through direct coupling of molecular and continuum models, a multi-disciplinary approach in which experimentally validated multi-scale modelling methods will be developed in order to generate new materials and interfaces for System-in-Package (SiP) products with tailored properties and improved reliability within an industrial environment. In this approach, a user-friendly software tool will be realised which incorporates chemical, physical and electrical information from the atomic level into macroscopic models (‘bottom-up’ approach). Furthermore, new and efficient micro- and nano-scale measurement techniques are developed for obtaining detailed information about the most important phenomena at micro- and nano-scale and fast characterisation and qualification of SiPs. An additional important distinguishing part of this project is that, due to the composition of the consortium, the whole industrial development chain is covered: from material development, multi-scale models and experimental methods towards a fully functional commercial software package, ready to be used within an industrial environment.
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Coordinator

PHILIPS ELECTRONICS NEDERLAND B.V.

Address

Boschdijk 525
5621 Jg Eindhoven

Netherlands

Activity type

Other

EU Contribution

€ 671 176

Administrative Contact

Patrick Keur (Mr.)

Participants (10)

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NXP SEMICONDUCTORS NETHERLANDS BV

Netherlands

EU Contribution

€ 61 008

INFINEON TECHNOLOGIES AG

Germany

EU Contribution

€ 140 815

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 618 360

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS

France

EU Contribution

€ 544 582

TECHNISCHE UNIVERSITEIT DELFT

Netherlands

EU Contribution

€ 521 999

DASSAULT SYSTEMES BIOVIA LIMITED

United Kingdom

EU Contribution

€ 194 485

AMIC ANGEWANDTE MICRO-MESSTECHNIK GMBH

Germany

EU Contribution

€ 188 775

SAINT PETERSBURG ELECTROTECHNICAL UNIVERSITY LETI

Russia

EU Contribution

€ 358 800

HONEYWELL INTERNATIONAL INC

United States

GEORGIA TECH LORRAINE ASSOCIATION

France

Project information

Grant agreement ID: 214371

Status

Closed project

  • Start date

    1 September 2008

  • End date

    31 August 2011

Funded under:

FP7-NMP

  • Overall budget:

    € 5 222 544,33

  • EU contribution

    € 3 300 000

Coordinated by:

PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands