Objectif The overall objective of QUICKCHIPS is to make available to industry in general, and to SMEs in particular, powerful new technologies and commercial structures supporting the design of ASICs and offering low-cost rapid turnaround prototyping.Project activities include: development of a set of computer aided design (CAD) tools based on commercially available software integrated into a powerful framework, supporting selective access to multiple foundries; enhancement of a direct write laser system to support foundry technologies needed for the mask free production of gate arrays; creation and optimization of back end wafer fabrication and finishing capability for multilevel interconnect metallization; establishment and phased build up of a telecommunications network serving the needs of geographically dispersed QCC operations. Design tools and a basic library of uncommitted logic have been integrated into a framework with technology with dependent output. A multilevel metallization process using a direct write laser lithography system has been installed at 2 partner sites. Studies of data communication options have shown that very small aperture satellite communications implementations are feasible and cost effective for geographically dispersed design centres. Demonstrator application specific integrated circuits (ASICs) in the project based Markov random field formulations represent useful advanced in real time image processing.This project is the application phase of work conducted in project 5047. The project consists of closely related activities in the areas of CAD, laser lithography equipment, interconnect process technology and telecommunications. In order to ensure the exploitation of results, the partners will be participating in the formation of a commercial organisation, the QCC Quickchips consortium, which aims to offer ASIC development support, prototyping and semiconductor brokerage services exploiting the new technologies developed in the project. Project activities include: - Development of a set of CAD tools based on commercially available software integrated into a powerful framework, supporting selective access to multiple foundries. - Enhancement of a direct-write laser system to support foundry technologies needed for the mask-free production of gate arrays. - Creation and optimisation of back-end wafer fabrication and finishing capability for multi-level interconnect metallisation. - Establishment and phased build-up of a telecommunications network serving the needs of geographically dispersed QCC operations. Champ scientifique natural sciencescomputer and information sciencessoftwareengineering and technologymechanical engineeringvehicle engineeringaerospace engineeringsatellite technologynatural sciencesphysical scienceselectromagnetism and electronicssemiconductivityengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationstelecommunications networksnatural sciencesphysical sciencesopticslaser physics Programme(s) FP3-ESPRIT 3 - Specific research and technological development programme (EEC) in the field of information technologies, 1990-1994 Thème(s) Data not available Appel à propositions Data not available Régime de financement Data not available Coordinateur INSTITUTO DE ENGENHARIA DE SISTEMAS E COMPUTADORES Contribution de l’UE Aucune donnée Adresse APARTADO 10105, RUA ALVES REDOL, 9 1017 LISBOA Portugal Voir sur la carte Coût total Aucune donnée Participants (8) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire CPRM/COMPANHIA PORTUGUESA RADIO MARCONI SA Portugal Contribution de l’UE Aucune donnée Adresse AV.DUQUE DE LOULE,, 97 1000 LISBOA Voir sur la carte Coût total Aucune donnée HEIDELBERG INSTRUMENTS MIKROTECHNIK Allemagne Contribution de l’UE Aucune donnée Adresse IM NEUENHEIMER FELD 518 69120 HEIDELBERG Voir sur la carte Coût total Aucune donnée INTERUNIVERSITAIR MIKROELEKTRONICA CENTRUM Belgique Contribution de l’UE Aucune donnée Adresse KAPELDREEF, 75 3030 HEVERLEE Voir sur la carte Coût total Aucune donnée INTRACOM SA-HELLENIC TELECOM.& ELECTR.INDUSTRY Grèce Contribution de l’UE Aucune donnée Adresse 19.5 KM MARKOPOULOU AVENUE, 68, 68 19002 PEANIA - ATTIKA Voir sur la carte Coût total Aucune donnée Institut für Mikroelektronik Stuttgart Allemagne Contribution de l’UE Aucune donnée Adresse Allmandring 30A 70569 Stuttgart Voir sur la carte Coût total Aucune donnée LASARRAY HOLDING Suisse Contribution de l’UE Aucune donnée Adresse THURGAN 8512 THUNDORF Voir sur la carte Coût total Aucune donnée Siemens AG Allemagne Contribution de l’UE Aucune donnée Adresse Otto-Hahn-Ring 6 81739 München Voir sur la carte Coût total Aucune donnée UNIVERSITY OF PATRAS Grèce Contribution de l’UE Aucune donnée Adresse 26500 PATRAS Voir sur la carte Coût total Aucune donnée