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Interconnection technologies for flexible systems

Interconnection technologies for flexible systems

Objective

InterFlex targets the development and standardisation of interconnects within flexible foil systems: On-foil connections of different components on a single substrate foil and interconnection of several functional foils into a foil system. The integration technologies required, when building a flexible foil system, i.e. homogeneous integration of electrical components on foils, heterogeneous Si IC-to-foil and foil-to-foil integration will be developed. This includes handling and alignment of silicon or foil based components on foil, electrical contacting, mechanical stabilisation, mechanical and electrical contacting via one-step lamination processes, as well as developing interconnection technology by vias. Reliability investigations will prevent failure mechanisms of flexible foil systems and their interconnections.The interconnection technologies will be applied in the realisation of a flexible, energy-autonomous system for environmental sensing with radio frequency communication capabilities. A combination of flexible amorphous silicon, photovoltaics and thin film foil battery provides the energy for driving sensors (temperature, dew point, humidity, CO2 concentration) and reading out their signals as well as driving the transmission of the sensor output to an external base station via a UHF radio frequency link at 868 MHz.The consortium of InterFlex consists of European industrial giants Bosch and ST Microelectronics who combine their expertise on packaging and flexible foil systems. Their expertise in complemented by Henkel Belgium in the materials field and by Infotech in the automation field, as well as leading applied research organisations CEA and Fraunhofer with background in flexible components and systems.

Coordinator Contact

Metin KOYUNCU (Mr.)

Coordinator

ROBERT BOSCH GMBH

Address

Robert-Bosch-Platz 1
70839 Gerlingen-Schillerhoehe

Germany

Activity type

Private for-profit entities (excluding Higher or Secondary Education Establishments)

EU Contribution

€ 531 771

Administrative Contact

Fabian Kurz (Mr.)

Participants (6)

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HENKEL ELECTRONIC MATERIALS BELGIUMNV

Belgium

EU Contribution

€ 170 584

INFOTECH AG

Switzerland

EU Contribution

€ 276 480

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 1 492 969

STMICROELECTRONICS (TOURS) SAS

France

EU Contribution

€ 130 000

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 340 650

STMICROELECTRONICS SRL

Italy

EU Contribution

€ 552 512

Project information

Grant agreement ID: 247710

Status

Closed project

  • Start date

    1 January 2010

  • End date

    30 November 2013

Funded under:

FP7-ICT

  • Overall budget:

    € 5 466 966

  • EU contribution

    € 3 494 966

Coordinated by:

ROBERT BOSCH GMBH

Germany