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Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors

Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors

Objective

SUCCESS targets to develop a technology platform and best-practice design methods to enable the breakthrough of silicon mm-Wave SoCs for high-volume applications. Silicon technology (CMOS, SiGe) has made tremendous progress towards ever higher device cut-off frequencies. Nowadays all RF components for mm-Wave sensing applications up to 120 GHz can be realized in silicon. Silicon technology hence allows integration of mm-Wave circuitry and digital logic for the realization of a true "mm-Wave System-on-Chip" (SoC). The mm-wavelengths allow mm-size antennas which potentially enable miniaturized wireless sensors systems with the size and form factor of an IC package. However several challenges make it difficult to arrive at real low cost. Firstly no true low-cost mm-wave packaging technologies with antenna-integration are available. Furthermore challenges in mm-wave SoC design arise in form of imprecise modelling and device variations. In addition production testing at such high-frequency is extremely expensive, time consuming, and error prone. SUCCESS is an initiative of 9 major industrial and excellent academic organisations. It represents a vertically integrated consortium bringing together semiconductor foundries, design houses, high-frequency packaging experts and industrial end users. The consortium encompasses universities, research institutions, SMEs and large industrial entities.Three topics will be addressed in the project:1. Development of a low-cost System-In-Package (SiP) technology and design platform with integrated antennas2. mm-Wave System-on-Chip (SoC) design methodology3. mm-Wave Built-In Self Test (BIST) and novel SiP test methodologyThe results will be demonstrated in a 122 GHz miniaturized sensor system, realized as surface mount component using plastic package technology.
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Coordinator

IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

Address

Im Technologiepark 25
15236 Frankfurt Oder

Germany

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 922 380

Administrative Contact

Uwe George (Mr.)

Participants (8)

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THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

Canada

HIGHTEC MC AG

Switzerland

EU Contribution

€ 189 500

SILICON RADAR GMBH

Germany

EU Contribution

€ 275 292

ROBERT BOSCH GMBH

Germany

EU Contribution

€ 501 082

KARLSRUHER INSTITUT FUER TECHNOLOGIE

Germany

EU Contribution

€ 428 159

SELMIC OY

Finland

EU Contribution

€ 234 180

STMICROELECTRONICS SA

France

EU Contribution

€ 350 922

Evatronix IP Spolka z ograniczona odpowiedzialnoscia

Poland

EU Contribution

€ 88 075

Project information

Grant agreement ID: 248120

Status

Closed project

  • Start date

    1 December 2009

  • End date

    31 May 2013

Funded under:

FP7-ICT

  • Overall budget:

    € 4 720 836

  • EU contribution

    € 2 989 590

Coordinated by:

IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

Germany