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Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future

Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future

Objective

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and device breakdown. To complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by Joule effect.
As time passes, heat and temperature management is becoming increasingly problematic, for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components, thus impacting the reliability of the electronic products which incorporate such devices.
The development of new, thermal-aware design paradigms can no longer be postponed if the goal is to enable designers to fully exploit the electronic technologies of the future, being those CMOS or alternative to CMOS.
The thermal problem has several facets, thus it needs to be addressed in a comprehensive manner. The THERMINATOR projects will address the following major challenges: 1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest. 3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.

Coordinator

STMICROELECTRONICS SRL

Address

Via C.Olivetti 2
20864 Agrate Brianza

Italy

Activity type

Private for-profit entities (excluding Higher or Secondary Education Establishments)

EU Contribution

€ 781 482

Administrative Contact

Salvatore Rinaudo (Mr.)

Participants (20)

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Synopsys Armenia CJSC

Armenia

EU Contribution

€ 69 400

KNOWLES ELECTRONICS AUSTRIA GMBH

Austria

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 490 171

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

Switzerland

EU Contribution

€ 249 418

SYNOPSYS SWITZERLAND LLC

Switzerland

EU Contribution

€ 206 500

NXP SEMICONDUCTORS GA GMBH

Germany

ChipVision Design Systems AG

Germany

NXP SEMICONDUCTORS GERMANY GMBH

Germany

EU Contribution

€ 495 951

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 309 992

OFFIS EV

Germany

EU Contribution

€ 598 228

MUNEDA GMBH

Germany

EU Contribution

€ 260 000

INFINEON TECHNOLOGIES AG

Germany

EU Contribution

€ 281 550

INTEL DEUTSCHLAND GMBH

Germany

EU Contribution

€ 522 613

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 500 636

BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM

Hungary

EU Contribution

€ 253 100

ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA

Italy

EU Contribution

€ 300 052

ST-POLITO Societa' consortile a r.l.

Italy

EU Contribution

€ 59 526

POLITECNICO DI TORINO

Italy

EU Contribution

€ 504 225

NXP SEMICONDUCTORS NETHERLANDS BV

Netherlands

EU Contribution

€ 410 966

GRADIENT DESIGN AUTOMATION, INC. - GDA

United States

Project information

Grant agreement ID: 248603

Status

Closed project

  • Start date

    1 January 2010

  • End date

    31 December 2012

Funded under:

FP7-ICT

  • Overall budget:

    € 10 997 930

  • EU contribution

    € 6 293 810

Coordinated by:

STMICROELECTRONICS SRL

Italy