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MiSPIA

Project ID: 257646
Źródło dofinansowania

Microelectronic Single-Photon 3D Imaging Arrays\nfor low-light high-speed Safety and Security Applications

Od 2010-06-01 do 2013-12-31, projekt zakończony | MiSPIA Witryna

Dane projektu

Całkowity koszt:

EUR 3 401 019

Wkład UE:

EUR 2 632 854

Kraj koordynujący:

Italy

Zaproszenie do składania wniosków:

FP7-ICT-2009-5See other projects for this call

System finansowania:

CP - Collaborative project (generic)

Description

3D cameras, based on the measurement of the Time-of-Flight of single photons by means of Single-Photon Avalanche Diode imagers, for automotive safety driving and security surveillance application
MiSPIA will develop beyond state-of-the-art photonics technology for array imagers of smart-pixels able to detect single photons. Intelligent in-pixel pre-processing will simultaneously provide ultra high sensitivity (single-photon level), very high frame-rate (up to 200,000fps) and advanced multi-spectral (300-900nm) three-dimensional (3D) distance ranging and two-dimensional (2D) imaging of fast moving objects. MiSPIA detectors will be used in two key applications: long-range (200-1,000m) 2D and 3D active identification in low light level surveillance operations; and very fast (over 200fps) short-range (10-50m) 3D monitoring in automotive pre-crash safety systems. Instead of (slow and noisy) CCDs and CMOS active pixels (with poor sensitivity and noisy electronics), MiSPIA will exploit the ultimate performances of truly-single photon detectors: the Single-Photon Avalanche Diodes (SPAD).MiSPIA imagers will be based on four different SPAD smart-pixels: “photon-counting” pixels for 2D imaging; LIDAR pixels for 3D direct “time-of-flight” (dTOF); two different phase-sensitive pixels for 3D indirect time-of-flight (iTOF) depth acquisitions. Full-size imager chips will be manufactured, characterized and eventually integrated into two 3D ranging cameras deployed into the two end-users applications for validation.MiSPIA technologies will be both highly-advanced and cost-effective: a high-voltage 0.35µm CMOS processing for front-side illuminated imagers; and a new flipped-chip Silicon-on-Insulator (SOI) CMOS technology for back-side illuminated imagers. Both will prove beyond state-of-the art co-integration of photonic SPAD detectors and CMOS microelectronics for intelligent and dense 2D imaging and 3D ranging high-performance cameras. Such cameras will provide imaging at the quantum limit and on-chip pre-processing at the most effective speed at a drastic reduction of manufacturing costs, down to 5€ per imager chip.The developments of the MiSPIA Project will be published on the official website www.mispia.eu.

Cel

MiSPIA will develop beyond state-of-the-art photonics technology for array imagers of smart-pixels able to detect single photons. Intelligent in-pixel pre-processing will simultaneously provide ultra high sensitivity (single-photon level), very high frame-rate (up to 200,000fps) and advanced multi-spectral (300-900nm) three-dimensional (3D) distance ranging and two-dimensional (2D) imaging of fast moving objects. MiSPIA detectors will be used in two key applications: long-range (200-1,000m) 2D and 3D active identification in low light level surveillance operations; and very fast (over 200fps) short-range (10-50m) 3D monitoring in automotive pre-crash safety systems. Instead of (slow and noisy) CCDs and CMOS active pixels (with poor sensitivity and noisy electronics), MiSPIA will exploit the ultimate performances of truly-single photon detectors: the Single-Photon Avalanche Diodes (SPAD).MiSPIA imagers will be based on four different SPAD smart-pixels: "photon-counting" pixels for 2D imaging; LIDAR pixels for 3D direct "time-of-flight" (dTOF); two different phase-sensitive pixels for 3D indirect time-of-flight (iTOF) depth acquisitions. Full-size imager chips will be manufactured, characterized and eventually integrated into two 3D ranging cameras deployed into the two end-users applications for validation.MiSPIA technologies will be both highly-advanced and cost-effective: a high-voltage 0.35µm CMOS processing for front-side illuminated imagers; and a new flipped-chip Silicon-on-Insulator (SOI) CMOS technology for back-side illuminated imagers. Both will prove beyond state-of-the art co-integration of photonic SPAD detectors and CMOS microelectronics for intelligent and dense 2D imaging and 3D ranging high-performance cameras. Such cameras will provide imaging at the quantum limit and on-chip pre-processing at the most effective speed at a drastic reduction of manufacturing costs, down to 5€ per imager chip.The developments of the MiSPIA Project will be published on the official website www.mispia.eu.

Koordynator

POLITECNICO DI MILANO
Italy

Wkład UE: EUR 808 260


PIAZZA LEONARDO DA VINCI 32
20133 MILANO
Italy
Activity type: Higher or Secondary Education Establishments
Kontakt administracyjny: Franco Zappa
Tel.: +390223996149
Faks: +39022367604

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Uczestnicy

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany

Wkład UE: EUR 875 000


HANSASTRASSE 27C
80686 MUNCHEN
Germany
Activity type: Research Organisations
Kontakt administracyjny: Christoph Schulte
Tel.: +49 89 12052728
Faks: +49 89 12057534

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EMZA VISUAL SENSE LTD
Israel

Wkład UE: EUR 140 000


HAYOZMA ST 3 RD
44422 KAFAR SABA
Israel
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny: Eitan Ramati
Tel.: +972 97679333
Faks: +972 9 7653550

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CF CONSULTING FINANZIAMENTI UNIONE EUROPEA SRL
Italy

Wkład UE: EUR 31 140


Via Giuseppe Mussi 1
20154 MILANO
Italy
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny: Carla Finocchiaro
Tel.: +30 02 310833 1
Faks: +39 02 33614064

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CENTRO RICERCHE FIAT SCPA
Italy

Wkład UE: EUR 117 654


STRADA TORINO 50
10043 ORBASSANO
Italy
Activity type: Research Organisations
Kontakt administracyjny: Massimo Casali
Tel.: +390119083492
Faks: +390119083786

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MICRO PHOTON DEVICES S.R.L.
Italy

Wkład UE: EUR 255 000


Via Stradivari 4
39100 BOLZANO
Italy
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny: Roberto Biasi
Tel.: +39 0471 051 212
Faks: +39 0471 501 524

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HERIOT-WATT UNIVERSITY
United Kingdom

Wkład UE: EUR 405 800


Riccarton
EH14 4AS EDINBURGH
United Kingdom
Activity type: Higher or Secondary Education Establishments
Kontakt administracyjny: Eva Olszewska-Day
Tel.: +441314513073
Faks: +441314513193

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