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Integrating Platform for Advanced Smart Textile Applications

Integrating Platform for Advanced Smart Textile Applications

Objective

The PASTA project will combine electronic packaging research and textile research to realize an innovative approach of smart textile. By introducing new concepts for electronic packaging and module interconnect, a seamless, more comfortable and more robust integration of electronics in textile will be possible. The main technological developments concentrate on a new concept for bare die integration into a yarn (by means of micromachining), a new interconnect technology based on mechanical crimping and the development of a stretchable interposer serving as a stress relief interface between the rigid component and the elastic fabric. Integration into the yarn will be used for small components and modules (< 1 mm), so that they can be fully integrated and encapsulated and further used in weaving. Larger modules for crimp contacts and with stretchable interposers are mounted on top of fabric substrates. Mechanical simulations will support these technological developments. A dedicated work package on fabric technologies will focus on fabric modifications for accommodating the new electronic packages : conductive yarns and textile-based sensors will be integrated into the basic fabric. And finally, dedicated equipment and manufacturing platforms will be developed for smart textile fabrication with the PASTA technologies. The technologies will be assessed in a functional evaluation and reliability testing program.The proposed solutions for integration of electronics in textile cover a whole range of components, from ultra small LEDs to complex multichip modules. A system design task will tackle the power distribution and system partitioning aspects. This assures that a complete solution is available for integration of a distributed sensor/actuator system in fabric. The concept for the new electronics integration technology will be shown in 4 different demonstrators in the area of technical textiles, sports and leisure wear, home textiles and bed linen.

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Address

Kapeldreef 75
3001 Leuven

Belgium

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 1 378 563

Administrative Contact

Christine Van Houtven (Ms.)

Participants (16)

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RICMAR TECHNOLOGY GMBH

Austria

FUNDICO BVBA

Belgium

EU Contribution

€ 276 000

ASYRIL SA

Switzerland

EU Contribution

€ 427 312

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

Switzerland

EU Contribution

€ 900 384

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 696 147

ETTLIN SPINNEREI UND WEBEREI PRODUKTIONS GMBH & CO KG

Germany

EU Contribution

€ 344 229

SAECHSISCHES TEXTILFORSCHUNGSINSTITUT E .V.

Germany

EU Contribution

€ 331 304

PEPPERMINT HOLDING GMBH

Germany

EU Contribution

€ 115 354

DECATHLON SA

France

PRIMO1D

France

EU Contribution

€ 41 710

CENTRE TECHNIQUE INDUSTRIEL DE LA PLASTURGIE ET DES COMPOSITES

France

EU Contribution

€ 381 763

HOLDING TEXTILE HERMES SAS

France

EU Contribution

€ 196 762

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 1 062 606

NIKE TECH MARIESTAD AB

Sweden

EU Contribution

€ 119 976

FOV FABRICS AB

Sweden

EU Contribution

€ 227 890

CP AUTOMATION SA

Switzerland

Project information

Grant agreement ID: 258724

Status

Closed project

  • Start date

    1 October 2010

  • End date

    31 March 2015

Funded under:

FP7-ICT

  • Overall budget:

    € 8 752 206

  • EU contribution

    € 6 500 000

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium