CORDIS
EU research results

CORDIS

English EN
Frequency Agile Microwave Bonding System

Frequency Agile Microwave Bonding System

Objective

The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro-systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies. Moreover, with the exodus of high volume packaging and assembly companies to low-wage countries such as China and India, the manufacturing industry in Europe needs to revitalise itself by encouraging design and innovation that will allow European companies to produce assembly equipment and materials of tomorrow that will feed into the Asian market. Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. In our approach we don’t need a closed microwave oven. Through the open design we can do the placement, alignment and curing at the same time. The use of this technology in reel-to-reel manufacturing will be possible. Due to the higher level of integration and signifcantly shorter cycle times this new technology will give European packaging companies a clear competitive advantage particularly over their US competitors. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant cavities frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, i.e. at the interface between a die and the substrate for example in the case of DCA. The project is driven bei 6 SME-IAGs who want to create this clear competitive advantage for theirmembers.

Coordinator

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Address

Hansastrasse 27c
80686 Munchen

Germany

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 83 538

Administrative Contact

Walter Krause (Mr.)

Participants (15)

Sort alphabetically

Sort by EU Contribution

Expand all

ACI-ecoTec GmbH & Co. KG

Germany

EU Contribution

€ 127 976,05

CAMERA DI COMMERCIO, INDUSTRIA, ARTIGIANATO E AGRICOLTURA DI MILANO

Italy

EU Contribution

€ 281 878,26

MICROTEC SUDWEST EV

Germany

EU Contribution

€ 97 555

National Micoelectronics Institute

United Kingdom

EU Contribution

€ 245 776

ACI ECOTEC GMBH

Germany

EU Contribution

€ 64 900,95

KEPAR ELECTRONICA SA

Spain

EU Contribution

€ 179 265

Industrial Microwave Systems Ltd

United Kingdom

EU Contribution

€ 34 462,74

RIBLER GMBH

Germany

EU Contribution

€ 180 168

HERIOT-WATT UNIVERSITY

United Kingdom

EU Contribution

€ 3 159

OSAUHING EESTI INNOVATSIOONI INSTITUUT

Estonia

EU Contribution

€ 1 781

UNIVERSITY OF GREENWICH

United Kingdom

ASOCIATIA ROMANA PENTRU INDUSTRIA ELECTRONICA SI SOFTWARE

Romania

EU Contribution

€ 24 511

SEHO SYSTEMS GMBH

Germany

EU Contribution

€ 115 030

RF. COM LIMITED

United Kingdom

EU Contribution

€ 186 110

FRESHFIELD MICROWAVE SYSTEMS LIMITED

United Kingdom

EU Contribution

€ 134 109

Project information

Grant agreement ID: 218350

Status

Closed project

  • Start date

    1 November 2008

  • End date

    31 October 2012

Funded under:

FP7-SME

  • Overall budget:

    € 2 322 707,54

  • EU contribution

    € 1 760 220

Coordinated by:

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany