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A Novel System for the Production of World's First Micro Ball Grid Array (µBGA) Spheres for enabling the EU Electronics Industry to produce smaller electronics goods

Project information

Grant agreement ID: 243653

Status

Closed project

  • Start date

    1 June 2010

  • End date

    31 May 2013

Funded under:

FP7-SME

  • Overall budget:

    € 3 924 714,02

  • EU contribution

    € 3 118 500

Coordinated by:

KINGSTON COMPUTER CONSULTANCY LIMITED

United Kingdom

Objective

There is relentless consumer demand for electronics equipment offering miniaturisation with higher functionality (e.g. cell phones playing music and movies whilst also offering email/SMS/camera functions). The industry is therefore continuously aiming for increases in integrated circuit miniaturization, processor speeds and circuit densities. The resultant increasing numbers of ever finer features on the silicon chip, and the need to electrically connect to them has stretched conventional wired or leaded electronics interconnect technology to its limits. This trend of miniaturisation with higher functionality looks set to continue, requiring fundamental advances in device electrical interconnect and mounting technology. Ball Grid Arrays (BGAs) is a key technology that simultaneously addresses the requirements for high density fine feature electrical interconnect and physical attachment of silicon chip devices. BGA is a 2-D array of miniature solder alloy spheres under the silicon chip that provides both electrical connection and mechanical attachment to a mounting socket or circuit board. The small diameter of the solder alloy spheres reduces electrical resistance and capacitance and helps to preserve electrical signal integrity. BGA technology facilitates a reduction in the silicon chip package size, better heat dissipation, and greater module (circuit) densities. Typical mobile phones and laptops contain 3,000 and 6,000 BGAs respectively. These BGAs are inside CPU, RAM, DSP, Memory sticks, Consumer electronic etc. The μBGAS project aims at wider SME companies who are interested in the development of novel production techniques for producing μBGAs of less than 150μm. The μBGAs system is targeted at all electronic product producing SME companies where miniaturisation is a major concern. This includes electronics for aerospace, automotive, mobile phones and laptops.
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Coordinator

KINGSTON COMPUTER CONSULTANCY LIMITED

Address

Worship Street 28-30 Crystal Gate
Ec2a 2ah London

United Kingdom

Activity type

Private for-profit entities (excluding Higher or Secondary Education Establishments)

EU Contribution

€ 238 964

Administrative Contact

Aasim Khalid (Mr.)

Participants (12)

SURFACE MOUNT AND RELATED TECHNOLOGIES LIMITED LBG - SMART GROUP

United Kingdom

EU Contribution

€ 436 527,50

FEDERATION OF HELLENIC INFORMATION TECHNOLOGY AND COMMUNICATION ENTREPRISES

Greece

EU Contribution

€ 410 222,50

ASSOCIACAO PORTUGUESA DE EMPRESAS DE TECNOLOGIAS AMBIENTAIS - APEMETA

Portugal

EU Contribution

€ 423 462,50

BIZESP LTD

United Kingdom

EU Contribution

€ 20 000

AINOOUCHAOU PLIROFORIKI AE

Greece

EU Contribution

€ 100 000

Semicon Sp. z.o.o.

Poland

EU Contribution

€ 60 000

SEMI EUROPE-GRENOBLE OFFICE

France

EU Contribution

€ 71 356

ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK

Poland

EU Contribution

€ 45 000

SURFACE MOUNT AND RELATED TECHNOLOGIES IRELAND LIMITED - SMART GROUP IRELAND

Ireland

EU Contribution

€ 501 211,50

ASSOCIATION OF INFORMATION TECHNOLOGY COMPANIES OF NOTHERN GREECE

Greece

EU Contribution

€ 384 506

COMPUTERISED INFORMATION TECHNOLOGY LTD

United Kingdom

EU Contribution

€ 347 250

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland

EU Contribution

€ 80 000

Project information

Grant agreement ID: 243653

Status

Closed project

  • Start date

    1 June 2010

  • End date

    31 May 2013

Funded under:

FP7-SME

  • Overall budget:

    € 3 924 714,02

  • EU contribution

    € 3 118 500

Coordinated by:

KINGSTON COMPUTER CONSULTANCY LIMITED

United Kingdom