Unique Smart anti-tampering and Enveloping TecHnologies

Objective

The UNSETH project aims to develop and qualify European based packaging and assembly technologies applicable to both Electronic modules and Systems-in-Package compatible with low cost secure solutions, tamper detection features and higher tamper resistance.
Security has become a vital part of European electronic products and equipments as they handle sensitive data in uncontrolled environments and as they face more and more IPR protection issues, counterfeiting and cloning issues. New applications combine a challenging set of requirements including low-cost, security and tamper-resistance. UNSETH will explore and derive the advantages which can be obtained by introducing new nanomaterials printed envelope, 3D embedded devices into electronic modules and SiP with active anti-tamper sensors as well as the combination of all, focusing on both the end products themself as well as the manufacturing process.
The project will analyze use cases constraints coupling with requirements and combine these with the intrinsic nanomaterial active envelope, embedded die security and tamper resistant SiP and cost benefits to obtain hardware architectural building blocks that will serve as a basis for prototyping but also as reference to analyze potential attacks and countermeasures to protect against these. Major achievements expected are protection against tampering and counterfeiting, higher security compatible with mass production cost and robust secure protection needed for high end products.
Our work will integrate results from ongoing embedded die technology work in the FP7 HERMES scheme. PCB module containing embedded dies will be used and integrated to build UNSETH technology prototype to be assessed with security evaluation. In this way and by using effective virtual prototyping for design, we achieve concept validation and manufacturing within the timeframe of this project.

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.

• engineering and technology mechanical engineering manufacturing engineering
• engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors
• engineering and technology nanotechnology nano-materials

Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

• FP7-SECURITY - Specific Programme "Cooperation": Security

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

• SEC-2012.5.3-1 - Embedded protection of security systems and anti-tampering technologies - Capability Project

Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

FP7-SEC-2012-1
See other projects for this call

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

CP-FP - Small or medium-scale focused research project

Coordinator

Participants (5)