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Horizon 2020 project information and now also report summaries are available on CORDIS. All H2020 projects can be downloaded from the EU Open Data Portal .

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Final Report Summary - DETECT (New product design and engineering technologies based on next-generation computed tomography)
The principal objectives of the DETECT project were to develop new basic hardware components and algorithms for fast and accurate Three-dimensional computed tomography (3D-CT) scanning for parts of any complexity and large dimensions, new algorithms for automated CT image proc...
Programme: FP6-NMP
Record Number: 51619
Last updated on: 2011-04-14
Final Report Summary - BIOCOMP (New Classes of Engineering Composite Materials from Renewable Resources)
The project aimed at new high quality bio-based composite materials to substitute synthetic plastics and wood. These materials in development should deliver a breakthrough in properties and use of engineering biocomposites. They comprise both, thermoplastic and thermoset mater...
Programme: FP6-NMP
Record Number: 50984
Last updated on: 2011-04-14
Final Report Summary - CODE (Curing polyester resins on demand)
The general object of the 'Curing polyester resins on demand' (CODE) project was the separation of the form filling process and the curing process of large polyester parts. For triggering the cross-linking of the resin microwaves were used. In the project the following objecti...
Programme: FP6-NMP
Record Number: 52117
Last updated on: 2011-04-14
Final Report Summary - MANVIS (Manufacturing Visions - Integrating Diverse Perspectives into Pan-European Foresight)
The aim of the project was to accompany the ongoing policy process of enhancing European competitiveness in manufacturing industries and to include views of European manufacturing experts. In order to develop strategies for maintaining and improving the competitive strength ...
Programme: FP6-IST
Record Number: 51011
Last updated on: 2011-04-14
Final Report Summary - ICON-HISIM (Intelligent controls for high-speed injection moulding machines)
The ICON-HISIM project aimed to enhance the European competitive edge in the field of plastic production by proposing the development of a high-speed injection moulding machine prototype which would introduce: - increased productivity without a subsequent increase in costs; ...
Programme: FP6-NMP
Record Number: 50788
Last updated on: 2011-04-14
Biomimetic intelligence
[REPORT SUMMARY] Biomimetic intelligence
The overall mission of NiSIS was to coordinate multi-disciplinary studies and research endeavours into the development and utilisation of intelligent paradigms in advanced information systems. The project has been actively supported by members from more than 60 research instit...
Programme: FP6-IST
Record Number: 46083
Last updated on: 2010-10-13
The OPERA final summit
[REPORT SUMMARY] The OPERA final summit
One of the major achievements of this last period of OPERA2015 was the planning, preparation and realisation of the OPERA2015 final summit. The Opera2015 summit had as main aims: - to disseminate and discuss the results of the OPERA2015 project, especially the outcome and anal...
Programme: FP6-IST
Record Number: 46071
Last updated on: 2010-10-13
Centralized economic allocation approach for application layer networks
The Grid is a promising technology for providing access to distributed computational capabilities such as processors or storage space. One of the key problems in current Grid infrastructures is deciding which jobs are to be allocated to which resources at what time. In this co...
Programme: FP6-IST
Record Number: 44459
Last updated on: 2009-04-06
Simulation framework future Grid and P2P applications including manual and automated scenario generator, simulator core and analysis tools
The CATNET simulation environment offers several tools for simulation economic resource allocation approaches in future P2P enabled application layer networks. This includes future Grid computing networks and service-oriented architectures. The tool set is composed of a manual...
Programme: FP6-IST
Record Number: 44463
Last updated on: 2008-12-09
Stencil printing technology for 100µm flip chip bumping
Stencil printing remains the technology route of choice for flip chip bumping because of its economical advantages over traditionally costly evaporation and electroplating processes. This paper deals with all processing facets of 6-wafer bumping of peripheral array structures ...
Programme: FP5-GROWTH
Record Number: 40815
Last updated on: 2007-11-15
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List retrieved on: 2018-08-19
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