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Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Periodic Reporting for period 3 - FineSol (Assembly of miniaturized PCBs by using low cost hyper-fine solder powders)

Reporting period: 2018-11-01 to 2019-04-30

FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. The overall objectives are: (a) Development of an upscale prototype atomization machine for production of type 8-9 solder spheres. During the first phase the atomization machine will be constructed based on integration of a modified atomization machine of high energy input with a coating sub- assembly apparatus for the straight formation of an anti-oxidant protective monolayer coating on the formatted powders. (b) Formulation of proper solder pastes containing the produced coated solder spheres. Solder pastes will be produced utilizing appropriate, environmental friendly fluxes, compatible with the organic coating of the solder spheres (c) Assembly of PCBs in lower reflow temperature compared to the current state of the art by utilizing the produced solder pastes, followed by characterization utilizing NDT methods.
The work performed since the beginning of the FineSol project is briefly presented below:

A. Generations of specifications and requirements:
i) Designs of atomization machine
ii) Protective coating - Chemistry of paste
iii) Reflow process – PCB assembly & QA
iv) NDT methods for inspection and tests
v) Demonstrators description

The relevant work has been reported in D2.1 2.2 2.3 2.4 and 2.5.

B. Development & integration of atomization production line:
i) Development of atomization sub-assembly and of coating sub-assembly
ii) Peripheral and support systems

iii) Control system and Integration of production line

The relevant work is almost finalised (D3.1 3.2 3.3 and 3.4 submitted)

C. Engineered design of solder paste formulation:
i) Selection of appropriate chemical ligand for surface oxidation protection
ii) Design of flux
iii) Solder paste production and characterization


The work performed for the selection of the appropriate organic agents for the surface oxidation protection was reported in details in D4.1. The design of flux and solder paste production continues. The D4.2 - Report on formulation of flux is submitted.


D. PCB assembly:
i) PCBs Assembly
ii) PCBs NTD inspection

Test patterns have been developed, PCBs have been evaluated, a reflow chamber has been built, CT X-ray has been upgraded and an automatic inspection system has been developed.

E. Demonstration activities of real devices in the FineSol project.

F. Industrial implementation issues:
i) Pre-normative research & standardization
ii) Life-cycle-analysis

A pre-normative research of standards relevant to FineSol was performed (D7.1). Information on existing standards related to the solder paste and fluxes was gathered. LCA has also started (D7.3).

G. Dissemination and exploitation. This includes:
i) Exploitation- Dissemination activities
ii) Knowledge management & IPR protection
iii) Innovation Management
iv) Training activities
v) Funding & investment plans


The business plan is being continuously updated. New market analysis data have been presented, including the identification & short description of the market leaders in the solder paste and PCB market, and the revenues of the market leaders. A list of SMEs that could be interested in the project results will also be identified in the remaining period. The competition analysis has revealed the competitor companies, information about their status in the market as well as the characteristics and the prices of the products they have launched. The pricing policy has been formed based on competition prices and on the total costs for production, labour and marketing. Simulations for future revenues are also planned for the remaining period.
The IP Registry has been completed. With respect to the ownership status, the cases of Joint Ownership have been identified and shares of ownership have been agreed based the nature of each beneficiary's contribution in the development of the Result.
Actions to protect the foreground have also been completed, as a patent application has been filed.
Based on the work in IP and Knowledge Management, additional business opportunities have been identified (licensing) as a result of the relevant patent application that has been filed recently.
Several dissemination and communication actions have taken place in Europe, and three actions have also taken place in Australia, Asia and America. In total, the consortium has so far completed 6 press releases, attended 4 exhibitions, communicated 3 flyers, used the social media pages to communicate the project, and has a dedicated website for the project. Additionally, the consortium has disseminated the Results in 9 scientific conferences where the partners participated, in 3 workshops, and in 5 events other than a conference or a workshop. Furthermore, the consortium has communicated the project in other events. D8.1 D8.2 and D8.5 have been submitted.
The main advancements of the FineSol project are:

Production of solder powder type 8 & 9: the project will advance in this stage by increasing the energy input in gas and centrifugal atomization methods and thus be able to produce solder powders in the range of 1-10 μm in high production yields.
Production of solder pastes type 8 & 9: formulation of low rosin solder pastes will be achieved in the project. This will have a significant positive impact in the level of the health protection of the workers in the electronic assembly industry. FineSol project will deliver solder pastes for both screen and jet printing that will allow high resolution printing for PCB assembly.

Miniaturized PCB assembly: the project will provide excellent capacity for further miniaturization of PCBs by delivering solder pastes of type 8 & 9 that will allow structures of high-density joints in the PCB. This will have multiple beneficial effect as, miniaturization of PCBs, increase of functionalities, minimization of wastes.

Innovation potential: solder powders and pastes as well as the production lines and methods that will result from the project will find uses in major segment of electronic industry and related fields such as consumer goods, automotive industry, hearing aid companies, telecommunications etc.

The expected impacts are:
1. Clear economic benefits for the participating partners, in terms of increase in sales and market penetration.
2. Strengthening partners competitiveness and the competitiveness of the electronics sector.
3. Creation of new employment job opportunities in the participating companies and in the electronics sector from the benefits offered by the new technologies developed.
4. Internationalization of participating SMEs through European co-operation for after project partnership.
5. Clear economic and environmental impact on EU economy from reservation of raw materials and reduction of energy as well as restriction of hazardous materials.
6. Higher level of automation and lower production times compared to current technologies.
7. Significant economic impact on EU economy from increase of exports and reduction of imports in the electronic industry due to the production of ultra-functional/ultra-miniaturized electronics equipment.
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