Community Research and Development Information Service - CORDIS

Basic and application specific technologies for flip-chip assembly using adhesives

Current implementations of flip chips are mainly based on soldering. The use of conductive adhesives offers several advantages: it is applicable on non-solderable substrates. Interconnection pitch can be much smaller and implementation can be profitable in much smaller production volumes.Substantial basic experience has been built up in the different processing steps for the realization of flip-chip assemblies using different kinds of adhesives (ACA, ICA, NCA) on different kinds of substrates (glass, flex, FR-4, LTCC): design of test chips for technology development, application of the adhesives, assembly technologies, optical and electrical evaluation of the assemblies, compatibility with mixed assembly, stress modeling and reliability testing.

Functional and technology demonstrators have been realized in flip chip on flex technology with ACA (LCD-drivers, hearing instrument) and flip chip on board technology with ICA (mixed assembly) and ACA (DSA for car radio). Qualifications tests have been passed including technological feasibility.

Two other investigated application areas, low-cost MCM-L based on ACA / FR-4 and BGA on FR-4 with ICA are considered non-exploitable.

The development of flip chip on glass technology with ACA was initiated, but did not reach the point, as initially put forward, due to technological and organizational problems at one of the partners.

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