Community Research and Development Information Service - CORDIS

Acceptance test procedure & user requirements

The Acceptance Test Procedure (ATP) document for the AT:1600 is a list of tests and specifications that the scanner has to meet during qualification in order to be accepted by the customer. The current ATP document is the result of a number of discussion rounds between ASML and the users involved in the project. The goal of these discussions was to define an ATP document that meets the user requirements. In other words, the ATP should ensure that if an AT:1600 scanner meets the specifications described in the ATP, it can be used by the users in their production environment. The resulting ATP document has tighter specifications than initially foreseen and was also made to be more inline with the ATP documents of other, more recent ASML scanners.

Final agreement about the ATP content was reached between ASML and the users during a conference call in November 2003. Although there were still some comments on a couple of specific items in the ATP document, the users agree in general with the content of the modified ATP document.

Following comments were made:
- A specification on MSD Z should be added to the ATP;

- Image distortion matching between different illumination settings is desirable;

- A CH test should be included in the FAT;

- Image distortion should also be tested with a hard pellicle mounted to the reticle;

- A test for 50 nm IL with alt PSM/AF should also be included in the FAT.

One general comment that was made was that for each section of the ATP a second illumination setting at which to conduct the test is desirable but which specific second illumination setting to use will be depend on the customer.

These comments will be added into a customer specific request section of the FAT. ATP and comments have been put together and written down as a deliverable.

A significant part of the specifications in the AT:1600 ATP are usable for ArF technology at the 65 nm node or immersion ArF technology at the 55..40nm node. This is true because many of the specifications are not so much related to the wavelength, which has been used but are more related to the lithographic resolution for which the technology has been developed. As a result the economic exploitation of the results still will happen although not at the wavelength which was originally anticipated.

Since ArF dry technology will be used to support the 65 nm node and ArF, immersion technology is expected to be used for the 55 - 40nm technology, 157nm technology would only be viable in combination with immersion for the 32 nm node. To explore this technology at the 32 nm node a lot of additional work has to be done which is outside the scope of the UV2Litho project.

More information on the UV2LITHO project can be found at:

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ASM Lithography B.V.
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