Forschungs- & Entwicklungsinformationsdienst der Gemeinschaft - CORDIS

Efficient plastic microfluidic packaging prototyping

Leti/CEA has developed different low temperature solutions for sealing the fluidic component of the chip to the silicon surface and which allows great flexibility in the fluidic circuit designs and in the choice of hybrid materials. Either solution may be used either for individual prototyping or for collective fabrication.

The first solution is a method to seal structured substrates by depositing a hermetic glue gasket on the top of the walls of the micro-fluidic components (channels, chambers, wells).

The process avoids filling the cavities with glue and has the following advantages:
- It can accommodate any hybrid material bonding (silicon, glass, or polymer);

- It is a low temperature process (the exact temperature is dependent on the curing mode) and it is therefore compatible with a wide range of polymers;

- It is compatible with pre-functionalised devices (such as chemical or biological grafting);

- It is compatible with high temperature uses (and has been validated in a thermal cycling PCR polymer fluidic device);

- It is compatible with thin structures such as channels (validated down to 30µm wide channels);

- It is compatible with individual and collective fabrication methods(validated on 4'' wafers).

The other solution uses laser ablated preformed double sticky tape. The gasket forms the fluidic circuit and brings hermetical bonding in a unique operation. This is particularly suited for large scale channels (minimum channel width = 300µm) and dismountable devices. This allows the polymer fluidic part to be disposable while the active more expensive silicon part is re-usable.

More information on the MEDICS project can be found at:

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