Service Communautaire d'Information sur la Recherche et le Développement - CORDIS

Computer simulation of the FLASiC process

The development of a comprehensive computer model for the FLASiC process is a major achievement. The model has deepened understanding of the FLASiC process and is a valuable process simulation tool, important for subsequent commercial exploitation.

A thermal model forms the core of the process model. The thermal model calculates heat flow, temperature distributions and the extent of any melting. Linked to the thermal model is an optical model, which calculates the energy, absorbed from the flash lamps taking into account the various layers in the FLASiC structure. Models include, as appropriate, the temperature dependence of material properties.

The model has facilitated the analysis of new concepts such as melt stop techniques which give greatly increased control of melting and greater tolerance of variations in flash lamp conditions. Investigations have shown that carbon diffusion plays a key role in liquid phase epitaxy in FLASiC and a model for the transport of carbon, linked to the thermal model, is able to explain experimental observations.

The non-uniform temperature distribution experienced by wafers during the FLASiC process leads to wafer stress and this has been predicted by linking a stress model to the thermal model. The software code is NOT limited to the FLASiC application but in modified manner to many other problems of msec-processing of materials

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Cambridge University, Engineering Department
Trumpington Street
CB2 1PZ Cambridge
United Kingdom
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