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FLASIC Résumé de rapport

Project ID: G5RD-CT-2002-00704
Financé au titre de: FP5-GROWTH
Pays: Germany

Harsh environment compatible sensor package

The aim of the miniaturized liquid property monitoring device based on the FPW (flexural plate wave) principle is to measure density and viscosity of chemically aggressive media in aeronautical applications. The target application for the described device is for propellant analysis. For packaging of the sensor elements, a special housing has been developed, fabricated and tested. Only the sensitive area of the 3C-SiC sensor chip is exposed to the environment, the rest is protected. The sensor is flip chip mounted on an LTCC component with electrical feed through. Inside the housing there is the miniaturized electronic board. Pins in the LTCC provide the electrical contact to the electronic board. The modular design allows for easy replacement and modification of the different components. Since the housing is made of PEEK and well sealed, the packaging protects sensor and electronics in the harsh environment

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Reported by

EADS Deutschland GmbH
81663 Munich