Forschungs- & Entwicklungsinformationsdienst der Gemeinschaft - CORDIS


EFSOT Berichtzusammenfassung

Project ID: G1RD-CT-2002-00838
Gefördert unter: FP5-GROWTH
Land: France

Solder paste for lead-free soldering

This result comprises a new innovative solder paste as well as its characteristics and functional tests. It corresponds to deliverables 1D8 and 1D11.

Based on SnAgCu alloys, it has been especially developed for very fine pitch soldering and for use in a wide range of applications, from consumer markets to critical automotive electronics. It exhibits safe residue in no clean process and good wettability with large reflow process window on different lead free finishes.

This product is widely available in Europe, Asia and North America.

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