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Adhesive bonding technique for ceramic rotatable targets

This result is related to the mounting of ceramic rotatable targets on the cylindrical backing tube. Due to the strong difference in themal expansion coefficients of metal and the ceramic target material, a bonding process by metallic soldering - unless performed as in result No. X - is often problematic.

To circumvent the problems related to thermal expansion stress, bonding using an adhesive material is an alternative. Since most adhesives are not applicable to vacuum processes due to strong outgassing and neither thermally stable, the development of an improved and thermally stable adhesive material suited for vacuum processes is the issue solved within this result.

The new adhesive material is described within the European patent application, which is cited within this result.

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Reported by

Wilhelm-Rohn Strasse, 25
63450 HANAU
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