Community Research and Development Information Service - CORDIS

FP6

EMCI — Result In Brief

Project ID: 508172
Funded under: FP6-SME
Country: Germany

New technology for flexible printed circuit boards

EU-funded researchers developed a patent-pending process for producing flexible printed circuit boards that could significantly enhance Europe’s position in a rapidly growing sector of the electronics industry.
New technology for flexible printed circuit boards
Flexible circuit boards are a rapidly growing and emerging electronics sector with widespread application for computer peripherals, hand-held devices and telecommunications equipment as well as automotive, aerospace and medical devices.

European researchers supported by funding of the EMCI project sought to develop an embedded micro connector injection (EMCI) process for the printed circuit board (PCB) manufacturing industry with a focus on reducing cost and environmental impact.

Given that flexible circuit materials are sensitive to the high temperatures required for lead-free soldering, extensive research was required to develop cost-effective solutions for small and medium-sized enterprises (SMEs). In addition, researchers sought to develop flexible PCBs and processing techniques compatible with standard surface-mount technology (SMT).

Research and development (R&D) focused on the necessary machines and tools required for the EMCI process and exploration of the potential for three-dimensional (3D) circuit boards.

A functional demonstrator exhibited good performance capabilities. Commercial exploitation of the many valuable results has the potential to enhance European SMEs’ position in the rapidly growing and widely applicable field of flexible PCBs with important benefits for business, the economy and consumers alike.

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