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Horizon 2020 project information and now also report summaries are available on CORDIS. All H2020 projects can be downloaded from the EU Open Data Portal .

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Animal and robot Societies Self-organise and Integrate by Social Interaction
ID: 601074
Start date: 2013-02-01, End date: 2018-01-31
The aim of ASSISI_bf is to develop (1) a fundamental new class of distributed ICT systems, which are bio-hybrid collective adaptive systems (CASs) that consist of two sub-systems: One is a self-organising society of animals; the other one is a society of technical devices. Th...
Programme: FP7-ICT
Record Number: 106691
Last updated on: 2017-04-25
Single Nanometer Manufacturing for beyond CMOS devices
ID: 318804
Start date: 2013-01-01, End date: 2017-03-31
To extend beyond existing limits in nanodevice fabrication, new and unconventional lithographic technologies are necessary to reach Single Nanometer Manufacturing (SNM) for novel 'Beyond CMOS devices'. Two approaches are considered: scanning probe lithography (SPL) and focuse...
Programme: FP7-ICT
Record Number: 104931
Last updated on: 2017-04-25
Towards 0.7 Terahertz Silicon Germanium Heterojunction Bipolar Technology
ID: 316755
Start date: 2012-10-01, End date: 2016-06-30
DOTSEVEN is a 3.5 year IP proposal for a very ambitious R&D project targeting the development of Silicon Germanium (SiGe) Heterojunction Bipolar Transistor (HBT) technologies with cut-off frequencies (fmax) of around 700 GHz. Special attention will be paid to clearly demonstr...
Programme: FP7-ICT
Record Number: 105240
Last updated on: 2017-04-25
Graphene-Based Revolutions in ICT And Beyond
ID: 604391
Start date: 2013-10-01, End date: 2016-03-31
This Flagship aims to take graphene and related layered materials from a state of raw potential to a point where they can revolutionize multiple industries – from flexible, wearable and transparent electronics, to new energy applications and novel functional composites.Our ma...
Programme: FP7-ICT
Record Number: 109691
Last updated on: 2017-04-22
POWER SoC With Integrated PassivEs
[PROJECT] PowerSwipe - POWER SoC With Integrated PassivEs
ID: 318529
Start date: 2012-10-01, End date: 2016-03-31
Europe is a world leader in innovative automotive systems with competencies covering the full supply chain from the main OEMs (Audi, BMW, Daimler, Fiat, PSA, RSA, VW) to Tier1 suppliers (Bosch, Continental, Magneti Marelli) to leading semiconductor companies (Infineon, ST). T...
Programme: FP7-ICT
Record Number: 105062
Last updated on: 2017-04-21
Semiconductor Equipment Assessment Leveraging Innovation
ID: 257379
Start date: 2010-06-01, End date: 2013-09-30
SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-ar...
Programme: FP7-ICT
Record Number: 95776
Last updated on: 2017-04-21
Nano Packaging Technology for Interconnect and Heat Dissipation
ID: 216176
Start date: 2007-11-01, End date: 2011-09-30
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integratio...
Programme: FP7-ICT
Record Number: 85245
Last updated on: 2017-04-19
Nano Optics for Molecules on Chips
ID: 216774
Start date: 2008-02-01, End date: 2011-07-31
This project aims at the demonstration of detailed control of molecules realized by means of
integrated electric, magnetic, radio frequency, micro wave and optical fields. The possibility of
integrating all these components on a microchip and scaling down to the micro...
Programme: FP7-ICT
Record Number: 85470
Last updated on: 2017-04-18
Integrated Circuit/EM Simulation and design Technologies for Advanced Radio Systems-on-chip
ID: 214911
Start date: 2008-02-01, End date: 2010-10-31
A big challenge awaits for technological developments to keep up with the demands in the market due to both the large variety of wireless communication channels as well as the fact that they are essentially all used at the same time by widely varying applications. For planned...
Programme: FP7-ICT
Record Number: 85568
Last updated on: 2017-04-13
Copper Interconnects for Advanced Performance and Reliability
ID: 216474
Start date: 2008-01-01, End date: 2010-11-30
The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of currently employedinterconnect formation processes enabling device scaling beyond the 32 nmtechnology node. This non-aqueous process will o...
Programme: FP7-ICT
Record Number: 85250
Last updated on: 2017-04-13
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List retrieved on: 2018-11-14
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