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MOdeling and DEsign of Reliable, process variation-aware Nanoelectronic devices, circuits and systems
ID: 120003
Data di inizio: 2009-03-01, Termine: 2012-02-01
The influence of process variations is becoming extremely critical for nanoCMOS technology nodes, due to geometric tolerances and manufacturing non-idealities (such as edge or surface roughness, or the fluctuation of the number of doping atoms). As a result, production yields...
Programme: FP7-JTI
Record Number: 210895
Last updated on: 2017-06-27
Models, Solutions, Methods and Tools for Energy Aware Design
ID: 120214
Data di inizio: 2010-04-01, Termine: 2013-03-01
Energy efficiency is one of the most critical aspects of today’s information society. Reducing the energy consumption of electronic devices, circuits and systems as well as improving energy generation, conversion, storage and management capabilities are the main challenges th...
Programme: FP7-JTI
Record Number: 210892
Last updated on: 2017-06-14
Large area silicon carbide substrates and heteroepitaxial GaN for power device applications
ID: 120218
Data di inizio: 2010-04-01, Termine: 2013-10-01
Power microelectronics represents an important segment of the semiconductor industry worldwide and is generally characterised by devices with low revenue but high strategic importance. The aim of the ENIAC JU project LAST POWER project is to make the European Union independen...
Programme: FP7-JTI
Record Number: 210890
Last updated on: 2017-06-14
Chip Architectures by Joint Associated Labs for European Diagnostics
ID: 120215
Data di inizio: 2010-03-01, Termine: 2013-02-01
The main objective of the ENIAC JU project CAJAL4EU is to develop miniaturised biosensor technology platforms enabling diagnostic test manufacturers to build multi-parameter in-vitro test applications rapidly in a robust, user-friendly and cost-effective way. They will involv...
Programme: FP7-JTI
Record Number: 201938
Last updated on: 2017-05-29
Joint Equipment and Materials for System-in-Package and 3D-Integration
ID: 120016
Data di inizio: 2009-04-01, Termine: 2012-03-01
The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems. This theme, generally known as “More Than Moore”, intends...
Programme: FP7-JTI
Record Number: 201936
Last updated on: 2017-05-29
Nanoelectronics for Mobile AAL Systems
ID: 120228
Data di inizio: 2010-04-01, Termine: 2013-03-01
The ENIAC JU project MAS is developing nanoelectronics components for applications in the field of health and wellness, and to create a development platform for the design of complete flexible, robust and safe mobile ambient-assisted-living systems. The project covers remote ...
Programme: FP7-JTI
Record Number: 201992
Last updated on: 2017-05-25
Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test
ID: 120227
Data di inizio: 2010-05-01, Termine: 2013-04-01
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life...
Programme: FP7-JTI
Record Number: 201943
Last updated on: 2017-05-25
Secure Memories and Applications Related Technologies
ID: 120224
Data di inizio: 2010-01-01, Termine: 2013-12-01
SMART Secure memories and applications-related technologies Growth in digital multimedia and in wired and wireless Internet- based services focuses attention on the need for protection of personal data and identification. Various electronic certification devices have been use...
Programme: FP7-JTI
Record Number: 201942
Last updated on: 2017-05-25
European 450mm Equipment & Materials Initiative
ID: 120222
Data di inizio: 2010-04-01, Termine: 2013-03-01
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produc...
Programme: FP7-JTI
Record Number: 201941
Last updated on: 2017-05-25
Micro and Nano Technologies Based on Wide Band Gap Materials for Future Transmitting Receiving and Sensing Systems
ID: 120220
Data di inizio: 2010-02-01, Termine: 2013-01-01
The ENIAC JU project MERCURE is developing advanced semiconductor materials to provide functionality not available before with silicon-based micro- or nanoelectronics. It will enable future ambient intelligence systems to achieve autonomous and self-reconfigurable operations ...
Programme: FP7-JTI
Record Number: 201939
Last updated on: 2017-05-25
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List retrieved on: 2018-11-18